In past, individual PCB depaneling from a production panel, has faced an onslaught of challenges given the rise of flexible PCB materials. Mechanical profiling techniques such as V-scoring and routing can easily damage sensitive and thin substrates, creating problems for PCB manufacturers who profile flex and rigid-flex boards. As a reliable flex and flex-rigid PCB manufacturer in China, MADPCB adopts laser cut technique for many years. Laser cutting can eliminate the effects of mechanical stress that occur during profiling such as burring, deformation, and damage to flexible circuit.
In the production of flex PCB and rigid-flex PCB, especially for prototypes and small batch, laser cutting will save your cost and reduces the turnarounds. In low quantity FPC fabrication, laser cut is mainly used for cutting flexible materials, including
In the fabrication of Dual-Access Flex Circuits, laser cutting or laser drilling plays an role of depth-controlled drilling, which is also called Laser Depth Control. The laser beam only ablate the flexible dielectric materials and will not damage copper.
At MADPCB, we always consider the competitive pricing for our customer when manufacture flexible circuits. Laser cutting is ideal for close tolerance before investing in expensive punching dies. For example, small form-fit devices or ZIF connectors. Laser cut profiling provides a great way to generate pattern routed b-stage adhesive. The laser process can form a “cured” edge along the rout path of the adhesive to reduce the amount of resin squeeze-out that is released by the press lamination process.
In laser cut processing, although most file types are acceptable, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In most cases, non-scaled data is required as MADPCB will make the appropriate scaling or offsets to meet production panel sizes.
