Helen Frankenthaler PCB Circuit Board R&D Center

Aluminum HDI PCB for Power Supply

PCB technologies for high-current management

material for pcb pcba assembly

High-current management

for control and power electronics

Your advantages

High currents of up to several hundred amperes are not uncommon in printed circuit boards. To ensure that the power electronics still function optimally, a lot of copper is needed in the right places on the PCB. We have the right technology for your high-current project.

  • Control and power electronics with high current on one board
  • Targeted partial cross-section enlargement for high-current paths
  • Minimizing the space required for high-current conductors
  • High current in combination with 3D installation geometries
  • Reduction of overall costs (logistics, procurement, assembly, quality assurance)
  • Design support and calculation of current paths
We are happy to support you in every phase of the realization of your 3D project. Contact our experts here.

High-current management

High currents of up to several hundred amperes are not uncommon today. To ensure that the power electronics still function optimally, a lot of copper is needed in the right places on the circuit board. At the same time, fine conductor structures for control tasks need to be placed on a circuit board.

With a broad technology portfolio for thick copper PCBs, we offer a reliable basis for power electronics requirements - tailored to your project. Our broad product range includes pure high-current PCBs as well as the combination of power and control electronics. Additional functions, such as 3D designs, increase the functionalities and application possibilities.

Comparison of technologies for high-current PCBs

Applications

Electrical distribution/fuses Tracked vehicle
StructureThick copper, 8 copper layers
MaterialFR4 - Isola DE104 (TG≈135 °C)
PCB thickness2.8 mm
Printed circuit board technologyIceberg®, plated through, Line/Space: 250/230 µm
Surfacechemical tin
Special featurescombined outer layer layout with 50 and 400µm copper thickness, Via Filling Type III-a
E-mobility
Structure4 layers multilayer, 70µm copper thickness
MaterialFR4 TG150°C Panasonic R-1566W
PCB thickness1.6 mm
Printed circuit board technologyHSMtec®, 8 and 12 mm wide copper profiles on the inside
Surfacechemical Ni/Au
Special featuresCopper profiles for 220A current flow and for heat dissipation on the back to the heat sink
Motor control for fan cooling
Structure4 layers multilayer, 70µm copper thickness
MaterialFR4 TG150°C Panasonic R-1566W
PCB thickness1.7 mm
Printed circuit board technology12mm, 8mm and 2mm wide copper profiles on an inner layer and an outer layer for 60 and 15 amps
Surfacechemical Ni/Au
Special featuresEight half bridges must be connected to the plugs with 4x15A = 60 ampere cables. The heat dissipation of the half bridges must take place via a bending edge to a PCB tab, which is bonded in the housing with an aluminum heat sink.

Technical article

Optimize high-current PCBs for motor controls:Electronics pr