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HIT's Goal in Micro-Drilling of Silicon Carbide (SiC) with PCD Drill

The goal is to see how HIT HSKE40 ultrasonic machining module can help optimize the process of micro-drilling of Silicon Carbide (Sintered SiC) with PCD drill in efficiency, hole quality, and tool life.

Ultrasonic-Assisted Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Machining Results

Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Machining Efficiency

• To optimize the micro-drilling process of sintered SiC with PCD drill and HIT ultrasonic module, the high frequency micro-vibration helped reduce drilling force.
• This allowed the volume of peck drill (Q) in the main drilling process to be raised 4x higher (from 0.01 to 0.04mm), which brought 2.5x higher overall machining efficiency (process time shortened from 18.3 to 7.2 min/per hole).

Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Hole Quality

• With HIT ultrasonic, the reduced drilling force helped stabilize the drilling process.
• Under 2.5x higher machining efficiency, the average size of edge-cracks was well-controlled and was 1.8x smaller thant that without ultrasonic under the same (optimized) parameters.

Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Tool Life

• With HIT ultrasonic, the high frequency micro-vibration brought easier inflow of cutting fluid, which led to better ceramic particle flushing.
• Along with the reduced drilling force, the tool wear was 3.2x less than that without ultrasonic under the same (optimized) parameters.

HIT Ultrasonic Machining Technology Achievements in Micro-Drilling of Silicon Carbide (SiC) with PCD Drill