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Copper Clad Polyimide Film - Kapton Tapes

Copper Clad Polyimide Film

Copper Clad Polyimide Film is made of flexible Copper laminated with Polyimide film. It’s widely used as flexible printed circuits (FPCs)

Copper Clad Polyimide FilmFeatures:

Excellent electrical, thermal, and heat resistance
Flame, Radiation, retardant property.
High bond and dielectric strength.
Excellent voltage resistance and tensile strength.
Excellent balance of the electrical, chemical, and physical property

Copper Clad Polyimide Film Data Sheet

Item	Unit	Data
Polyimide Film
Tensile Strength	MD/MPa	≥135
TD/MPa		≥110
Elongation	MD/%	≥35
TD/%		≥40
Breakdown Strength	KV/mm	≥120
Volume resistivity 200+/-5c(392F)	Ω·m	≥1×10^13
Surface resistance 200+/-5c(392F)	Ω	≥1×10^10
Dielectric dissipation factor 50Hz		≤1.0×10^3
Copper
Thermal Stress(float288℃/unetched)	Sec	≥10
Warpage(without treatment)	%	≤1.0
Cu Surface resistance	MΩ	≥1×10⁵
Dielectric constant	1MHz	≤4.0
Dissipation Factor	1MHz	≤0.035
Flammability	UL94	V-0
Moisture absorption	%	≤0.8
Chemical Resistance		Pass

Copper Clad Polyimide Film Thickness

Thickness（μm）	Copper	35	35	18	35	18
Adhesive	13	25	25	25	25	25
Polyimide	13	13	25	25	50	50
Copper	35	35	18	35	18	35
Adhesive	13	25	25	25	25	25
Polyimide	13	13	25	25	50	50
Adhesive	13	25	25	25	25	25
Copper	35	35	18	35	18	35

Copper Clad Polyimide Film Structure

Data Sheet

Thickness

Structure

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Shu Yan Copper Clad Kapton Film 3L

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