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Advanced PCB Materials

AGC Solutions Guide

“Your Dreams, Our Challenge”

Established 100 years ago, AGC has evolved into a world leading supplier of : architectural / automotive glass, electronic materials such as CMP slurries and silicon carbide, chemicals including fluoro products and refrigerant gases, ceramics such as refractory materials and now mult i m aterials.

AGC’s multi material division is focused on the development of dielectric substrates for high frequency electronics such as high -speed wired and wireless communication, intelligent vehicle, aerospace & defense and next generation satellite communication.

www.agc -multimaterial.com

Advanced PCB Materials

AGC’s Multi Material division develops and manufactures a full range of RF and Digital Materials, including thermoset and thermoplastic copper clad laminates and prepreg / bondply substrates, which provide high reliability and superior thermal, mechanical and electrical performance.

Thermoplastic material s are designed for critical RF/Microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the PTFE resin system the material of choice for your lowest loss, high frequency applications .

Thermo set materials ar e intended for use in core routers, high speed switches, supercomputers, next - generation radio communication and applications where low signal attenuation, high reliability and high data transfer rates are critical.

PTFE Resin System

Part NumberDielectric Constant (Dk)Dk Tolerance ±Dissipation Factor (Df)Moisture Absorption %Thermal Conductivity W/M*KCTE (1) ppm/°CPeel Strength lbs/in
TLY -5A2.170.020.00090.020.222612
TLY -52.200.020.00090.020.222612
TLY -5Z2.200.040.00150.030.20307
TLY -32. 330.020.00 120.020.222612
TLX -82.550.040.001 80.020. 192112
TLE -952.950.050.00260.020.2 0912
RF -30A2.97 (2)0.050.00200.050.42812
NF -303.000.040.00130.050.50118
TSM -DS3M2.940.040.001 40.070.65108
TSM -DS3b3.000.040.001 40.070.65108
TSM -DS33.000.050.001 40.070.65108
TLC -323.200.050.00300.020.24912
RF -35TC3.500.050.0 020.050.92117
RF -35HTC3.500.050.00070.071.84116
TLF -35A3.50 (2)0.050.002 60.020.3 72110
RF -60TC6.150.150.00200.031.05108
RF -1010.200.300.00250.080.851610

Thermoset Resin Systems

PPE / Modified Epoxy / Polyimide Laminates

Part NumberDielectric Constant (Dk)Dissipation Factor (Df)Tg °CCTE (1) ppm/ °C
Meteorwave® ELL 1013.0 50.00 1219012
Meteorwave® ELL 10 23.0 30.00 0919012
Meteorwave® 10003.40.004724 010
Meteorwave® 20003.20.003424010
Meteorwave® 30003. 40.003920010
Meteorwave® 33503.50.003820010
Meteorwave® 40003. 30.002420010
Meteorwave® 4000M3.30.00220024
Meteorwave® 80003.280.001618514
Meteorwave® 83003.00.002519014
Meteorwave® M13.10.001823018
N4000 -133.60.00924010
N4000 -13 SI®3.20.00 824010
N4000 -13 EP3.60.00924010
N4000 -13 EP SI®3.20.00 82409
N7000 -2 HT / -33.50.009260 (DSC)9
N7000 -33.50.009260 (DSC)9

Prepregs Bonding Films

Part NumberDielectric Constant (Dk)Dissipation Fact or (Df)Moisture Absorption %Thermal Conductivity W/M*KCTE (1) ppm/°C
fastRise FR -252.430.00 120.080.2559
fastRise FR -272.770.00140.080.2559
fastRise FR -282.760.00140.080.2559
fastRise FR -EZ-22P2.400.00180.130.33109
fastRise FR -EZ-33 P2.500.00240.140.3397
fastRise EZpure2.800.00320.310.3344
FastRise TC4.800.00230.070.9422
No Flow Prepregs
Part NumberDielectric Constant (Dk)Dissipation Factor (Df)Tg °CCTE (1) ppm/ °C
N4000 -29NF4.00.01719912
Meteorwave 1000NF3.40.004724010

Note :

  • All test data provided are typical values and not intended to be specification values.
  • CTE (1) values vary by temperature range of measurement. Please inquire for specific product temperature range.
  • (2) Measured by IPC -TM -650 method 2.5.5.5.1 (modified stripline) at 1.9 GHz .
  • Please refer to the data sheet for each product for detailed values.

Copper Cladding For RF Materials

Optical measurements (e .g. Bruker Optical Measurements)

DescriptionSurface Roughness RMS Treated sideSurface Roughness RMS Untreated side
Ultra Low Profile ½ ozComparable to rolled copper- see scanning electron microscope images below
Ultra Low Profile 1 oz
Rolled -Annealed ½ oz1512
Rolled -Annealed 1 oz119
Reverse Treated Electrodeposited ½ oz4644
Reverse Treated Electrodeposited 1 oz3952
High Ductility Very Low Profile Electrodeposited ½ oz6618
High Ductility Very Low Profile Electrodeposited 1 oz6019

* Above copper foil types may not be available for all AGC products, please contact your technical service representative with questions.

Roll ed -Ann ealed Copper (Treated surface ) x 3,000

Roll ed -Ann ealed Copper (Cross section) x 1 ,000

Ultra Low Profile Copper (Treated surface ) x 3 ,000

Ultra Low Profile Copper (Cross section) x 1,000

Resistor foils available upon request.

  • ½ oz. copper = 0.7 mils or 17.5 microns
  • 1 oz. copper = 1.4 mils or 35.0 microns
  • 2 oz. and other coppers available upon request

Optical measurements are not accurate to characterize the differences between ultra low profile and rolled -annealed copper. Scanning electron microscope analysis shows a very comparable surface roughness. Insertion loss comparisons are available by request.

Common Panel Sizes

DescriptionCommon Panel Size
PTFE Materials36” ×48”, 18” ×24”, 18” ×16”, 18” ×12”
fast Rise ᵀᴹ18” ×24”, 18” ×16”, 18” ×12” , 24 ”×36 ”

Copper Cladding For Digital Materials

DescriptionRTFHS -VSPHS -M2 -VSPHS2 -M2 -VSP
ProfileVLP (RTF)VSPVSPHS2 -VSP
Industry Call OutGRADE 3Industry Call OutGRADE 3Industry Call Out
AMMA Call OutRTFHS -VSPHS -M2 -