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Taconic PCB/Taconic RF-35 High Frequency Printed Circuit Board: DK 3.5 RF PCB Options (10mil, 20mil, 30mil, 60mil)

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Taconic RF-35 High Frequency Printed Circuit Board: DK 3.5 RF PCB Options (10mil, 20mil, 30mil, 60mil)

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Product Overview

Introducing the Taconic RF-35 High Frequency Printed Circuit Board, a premier choice for low-cost, high-volume commercial microwave and radio frequency applications. This PCB is constructed from an organic-ceramic laminate material from Taconic's ORCER family, characterized by:

  • Material Composition: Based on woven glass reinforcement and Taconic's advanced ceramic filling technology.

  • Peel Strength: Exceptional peel strength for ½ oz and 1 oz copper, essential for rework situations.

  • Thermal Properties:Glass transition temperature (Tg) exceeding 315°C.

  • Moisture Resistance: Ultra-low moisture absorption and low dissipation factor minimize phase shifts at high frequencies.

  • Dimension Stability:Woven fabric design ensures stable dimensions.

Copper Options

Our RF-35 PCBs come with electrodeposited copper options available in:

10mil,20mil,30mil,60mil

Benefits

By choosing RF-35, you gain advantages such as:

  • Cost-Effectiveness: Ideal for high-volume production.

  • Enhanced Performance:Excellent peel strength and low dissipation factors.

  • Surface Smoothness: Improved surface quality for better reliability.

Typical Applications

RF-35 PCBs are perfect for:

  • Power Amplifiers

  • Filters and Couplers

  • Passive Components

Our PCB Capability (RF-35)

PCB Capability (RF-35)
PCB Material:PTFE Ceramic Fiberglass
Designation:RF-35
Dielectric constant:3.5
Dissipation Factor 0.0018
Layer count:Single Layer, Double Layer, Multilayer, Hybrid PCB
Copper weight:1oz (35µm), 2oz (70µm)
Laminate thickness:5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, ENEIPIG, Pure gold, OSP etc..

RF-35 Typical Value

PropertyTest MethodUnitValueUnitValue
Dielectric Constant @ 1.9 GHzIPC-TM 650 2.5.53.53.5
Dissipation Factor @ 1.9 GHzIPC-TM 650 2.5.50.00180.0018
Moisture Absorption (.060")IPC-TM 650 2.6.2.1%0.02%0.02
Peel Strength (1/2 oz. copper)IPC-TM 650 2.4.8lbs./linear inch>8.0N/mm>1.5
Peel Strength (1 oz. copper)IPC-TM 650 2.4.8lbs./linear inch>10.0N/mm>1.8
Dielectric BreakdownIPC-TM 650 2.5.6kV41kV41
Volume ResistivityIPC-TM 650 2.5.17.1Mohm/cm1.26 x 10 9Mohm/cm1.26 x 10 9
Surface ResistivityIPC-TM 650 2.5.17.1Mohm1.46 x 10 8Mohm1.46 x 10 8
Arc ResistanceIPC TM 650 2.5.1seconds>180seconds>180
Flexural Strength LengthwiseASTM D 790psi>22,000N/mm2>152
Flexural Strength CrosswiseASTM D 790psi>18,000N/mm2>124
Thermal ConductivityASTM F 433W/m/K0.24W/m/K0.24
Tensile Strength LengthwiseASTM D 638psi27,000N/mm2187
Tensile Strength CrosswiseASTM D 638psi21,000N/mm2145
Dimensional Stability LengthwiseIPC-TM 650 2.4.39in/in0.00004mm/mm0.00004
Dimensional Stability CrosswiseIPC-TM 650 2.4.39in/in-0.0001mm/mm-0.0001
x-y CTEASTM D 3386 (TMA)ppm/°C19-24ppm/°C19-24
z CTEASTM D 3386 (TMA)ppm/°C64ppm/°C64
FlammabilityUL-94V-0V-0
HardnessRockwell M Scale3434

DK List

TypeDk
TLY-5A2.17
TLY-52.20
TLY-32.33
TLT-0 TLX-02.45
TLT-9 TLX-92.50
TLT-8 TLX-82.55
TLT-7 TLX-72.60
TLT-6 TLX-62.65
TLE-952.95
TLC-272.75
TLC-303.00
TLC-323.20
RF-303.00
RF-35 RF-35P3.50
RF-606.15
CER-1010

Explore the capabilities of our RF-35 high frequency printed circuit boards today and elevate your design solutions!