Ceramic Prototype PCB for Communication Equipment

Ceramic Substrates PCB Board Al2O3 Base Material Ceramic Thermal Management PCB

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Product Information

Name: Ceramic Substrate Material: Ceramic Board thickness: 1.6mm Surface treatment: Immersion Gold Technology: Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias Payment: L/C,T/T,WesternUnion Certification: UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications) Delivery Term：DDU, FOB, CFA, CIF, CPT, EXW Price Get Latest Price

Product Comparison

Rocket PCB carries out strict quality monitoring and cost control on each production link of printed circuit board, from raw material purchase, production and processing and finished product delivery to packaging and transportation. This effectively ensures the product has better quality and more favorable price than other products in the industry. Compared with products in the industry, Rocket PCB's printed circuit board has the outstanding advantages which are mainly reflected in the following aspects.

Company Advantages

• Our ceramic pcb have a wide range of material category, taking different processes.
• As the 'Quality First' is the principle of Rocket PCB, the quality of this product has been fully guaranteed.
• Rocket PCB Solution Ltd. undertakes to ensure that its production complies with the quality assurance system.
• We have the professional QC team to secure the quality of ceramic pcb.

Product Description

Processing alumina ceramic-based copper clad laminate, alumina ceramic laminate, LED ceramic laminate, Al2O3 ceramic laminate, high thermal conductivity ceramic PCB, ceramic-based CCL PCB

Ceramic-based circuit board is based on ceramics as a matrix material and fabricates electronic components of metal circuits on it. It is an indispensable basic material for power module packaging in the electronic field. Ceramic substrates refer to the special process of copper foil bonding directly to the surface of alumina (AL2Q3) or aluminium nitride (ALN) ceramic substrates (single or double sides) at high temperature. The ultra-thin composite substrate has excellent electrical insulation, high thermal conductivity, excellent solderability and high adhesion strength. It can etch various patterns like PCB board, and has great current carrying capacity. Therefore, ceramic substrate has become the basic material of high-power electronic circuit structure technology, and is the best choice for high-power LED, power devices, microwave devices, automotive electronics, high-frequency devices, solar cell components and other applications.