With over 10 years of R&D and production experience in ceramic substrates, we focus on tech breakthroughs for peak product performance, quality and higher production efficiency.
Tailored for diverse scenario requirements, we offer optimized material solutions to balance performance, reliability and cost-efficiency.
The ceramic PCB materials we produce include alumina, aluminum nitride, silicon nitride, beryllium oxide (BeO), sapphire, glass, ferrite and diamond.
From material selection to process control, every detail follows "high-reliability" standards to create industry-leading ceramic substrates.
Substrate thermal conductivity reaches up to 220 W/(m·K), 500-600x that of traditional FR-4, reducing component operating temperature and extending lifespan.
Stable operation in -55℃ to 1500℃ extreme temperature ranges, meeting strict requirements of aerospace and military industries for high-temperature resistance.
Advanced processing enables 0.05mm ultra-fine lines and 0.1mm micro-vias, satisfying high hermeticity, low outgassing and high-frequency and high-speed signal transmission needs.
Thermal Expansion Coefficient (CTE) matches chips at 3ppm/℃, effectively reducing solder joint thermal stress and improving product reliability.
Compliant with AS9100, IATF16949 standards, thermal shock testing, with defect rates controlled below 0.03%.
We offer one-stop services, including material selection, structural design, SMT assembly, IC packaging and thermal simulation, to optimize performance and cost for specific scenarios.
With "millimeter-level precision, micrometer-level control" as the standard, we ensure high quality through five core processes.
From new energy vehicles to medical devices, from 5G communication to aerospace, our ceramic substrate solutions are the core choice for high-end fields.
Automotive Electronics
Medical Equipment
5G Communication
Aerospace and Defense
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Have more questions? Our technical team is ready to help.
Authentic feedback from clients, validating our product quality and service level.
"Our industrial power modules operate long-term in high-temperature environments above 150℃. Previously, using ordinary PCBs led to frequent thermal failures. After switching to ceramic-based PCBs, the thermal conductivity efficiency has significantly improved. They've run continuously for 6 months with zero failures, and the device temperature has dropped by 28℃ compared to before. The stability has completely exceeded expectations—truly a reliable choice for high-power applications!"
—— Mark Reynolds, Senior Power Electronics Engineer
"The core heat dissipation area of our high-end projectors has long been limited by space constraints. The thin and lightweight properties of ceramic-based PCBs perfectly fit the product design: despite a thickness of only 0.6mm, they quickly conduct heat away from the chip. This allows the projector to operate continuously for 3 hours while keeping the body temperature below 45℃. User feedback indicates a significant improvement in experience, with the repair rate dropping by 35%."
—— Emily Carter, RF Systems Engineer
"When selecting a substrate for our automotive radar module, we compared multiple options and ultimately chose ceramic-based PCBs. Not only can they withstand vibration and impact during vehicle operation, but signal transmission remains stable within the wide temperature range of -40℃ to 125℃. After 1,000 thermal cycle tests, there was no cracking or desoldering whatsoever—fully meeting automotive-grade reliability requirements."
—— David Larson, R&D Electrical Engineer
