Conversion of single-board computer assembly on FR-4 (right) to MPT ceramic engineered substrate (left). MPT can do the same for your product/designs that require efficient thermal management.
Ceramic substrates such as alumina, aluminum nitride, and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently, dissipating it over the whole surface. PCB material (FR-4) is epoxy based with poor thermal conductivity, leading to hot spots which reduce the life of most semiconductor junctions. Typical thermal conductivities of ceramics and FR-4 are:
MPT is building on its experience with hybrid technology in designing and fabricating hybrids for high temperature operation. Hybrids are microelectronic circuits comprising multiple devices, often in die form, within a hermetically sealed metal enclosure or an impervious conformal coating. The ceramic substrates used in hybrids have their conductive traces, insulating layers and printed resistors fired at 850°C, and are routinely designed to operate long term in the 150-250°C range. By comparison, FR-4 PCB assemblies are typically rated for a maximum temperature of 130°C for short periods, beyond which damage to the PCB structure starts to occur.
Resistor values can be adjusted by laser trimming during the functional operation of the circuit, allowing the dynamic tuning of circuits as an automated production process.
Single-board computer assembly on MPT ceramic engineered substrate (left) and FR-4 (right). All electrical characteristics and specifications are maintained.
MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, certified by DSCC (Defense Supply Center, Columbus, OH). MPT is AS9100D ISO 9001:2015, and ITAR registered.
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