Copper Core Flex PCB for Power Supply

Rogers Offers Direct Bond Copper PCB Substrates Built for High Current, High Heat, and Long Life

Rogers Corporation has introduced a new line of Direct Bond Copper (DBC) substrates designed for demanding applications requiring high current, high heat, and long operational life. These substrates are engineered to provide superior thermal management and reliability in power electronics.

Key Features and Benefits

The DBC substrates offer several advantages for high-performance applications:

• Excellent thermal conductivity for efficient heat dissipation.
• High current carrying capacity.
• Robust mechanical strength and long-term reliability.
• Strong bond between copper and ceramic, ensuring durability under thermal cycling.

Target Applications

These substrates are ideal for use in various industries and applications, including:

• Electric vehicle power modules
• Renewable energy inverters
• Industrial motor drives
• High-power RF devices

Technical Specifications

The product line includes various ceramic options and copper thicknesses to meet specific design requirements.

Availability and Support

The substrates are available for sampling and volume production. Rogers provides comprehensive technical support to assist with design and integration.