flex pcb ai

Flex PCB Technical Capabilities

rigid flex pcb wire harness

Flex PCB Technical Capabilities

FPC Layer

NO.	ITEM	Standard Capabilities	Special Capabilities
1	FPC Layer	1-12L	1-16L

FPC Material

NO.	ITEM	Standard Capabilities	Special Capabilities
2	Base Material	PI (12.5um, 25um, 50um)	100um
3	Copper Type	RA Copper: 12um, 18um, 35um, 70um ED Copper: 12um, 18um, 35um, 70um	6um, 9um, 100um
4	PI Coverlay	12.5um, 25um, 50um	100um
5	Adhesive	PSA Adhesive: 50um-100um (3M467, Tesa 8853, Tesa 8854, etc.)
6	Hot-Press Adhesive	13um, 25um
7	Stiffeners	PI Stiffener: 12.5/25/50/75/100/125/150/200/250 (um) PET Stiffener: 0.125/0.188/0.25(mm) FR4 Stiffener: 0.1mm-2.0mm SUS Stiffener: 0.1mm-0.6mm Aluminum Stiffener: 0.2mm-2.0mm	2mm
8	EMI shielding film	HCF-6000G, PC800, etc.	100um

Board Size & Thickness

NO.	ITEM	Standard Capabilities	Special Capabilities
9	Biggest Board Size	500mm*600mm
10	Longest Board Size	1-2L: 4000mm 3-4L: 2480mm
11	Biggest Board Thickness	2.0mm
12	Thinnest Board Thickness	0.05mm
13	Thickness Tolerance	0.05mm～0.24mm: ±0.03mm 0.25mm～0.47mm: ±0.05mm

Drill

NO.	ITEM	Standard Capabilities	Special Capabilities
14	Minimum Hole Size	0.1 mm	0.025mm
15	Holes Size Tolerance	±0.05 mm
16	Holes Posistion Tolerance	±0.05 mm
17	Minimum vias Pad Size	0.3mm	0.2mm
18	Minimum Annular Ring Size	0.1mm	0.075mm
19	Blind/Buried Vias	Yes

Copper Tracks and Plating

NO.	ITEM	Standard Capabilities	Special Capabilities
20	Minimum Track Width/Space (70um Copper)	0.15mm/0.2mm	0.1mm/0.15mm
21	Minimum Track Width/Space (35um Copper)	0.1mm/0.1mm	0.075mm/0.075mm
22	Minimum Track Width/Space (18um Copper)	0.07mm/0.07mm	0.05mm/0.05mm
23	Minimum Track Width/Space (12um Copper)	0.04mm/0.04mm	0.035mm/0.035mm
24	Track Width Tolerance	20%	0.02mm
25	Tracks/Pads Position Tolerance	≥0.06 mm	≥0.05 mm
26	Tracks/Pads To Board Edge	≥0.15 mm	≥0.05 mm
27	Golden Finger Pitch Tolerance	Pitch:10~20mm : ± 0.03mm, Pitch:20~50mm : ± 0.05mm
28	Copper Plating Thickness	8-20um
29	Hole Copper Thickness	8-20um	35um
30	Minimum Copper Thickness for Hollow Out FPC	35um

Surface Finish

NO.	ITEM	Standard Capabilities	Special Capabilities
31	ENIG	AU: 1-2u" Thickness NI: 40-120u" Thickness	3u” Thickness
32	Electrolytic Nickel Gold (Hard Gold Plating)	AU: 1-50u” Thickness NI: 80-320u" Thickness
33	Immersion Silver	Ag: 6-12u" Thickness
34	OSP	8-16u" Thickness
35	Immersion Tin	SN: 10-60u" Thickness
356	Tin Plating	SN: 5-30um Thickness
37	ENEPIG	Au：1-4u" Thickness NI: 120-200u" Thickness Pd：1-6u" Thickness

Coverlay

NO.	ITEM	Standard Capabilities	Special Capabilities
38	Coverlay Opening Size Tolerance	±0.1 mm	±0.03 mm
39	Minimum Drilling Size on Coverlay Opening	0.45mm	0.2mm
40	Minimum Square Size on Coverlay Opening	0.7mm*0.7mm	0.2mm*0.2mm
41	Coverlay Opening Position Tolerance	±0.1 mm	±0.03 mm
42	Coverlay Align Tolerance	±0.1 mm	±0.02 mm
43	Excessive Glue	≤0.15 mm
44	Minimum Area of Excessive Glue	≤20% Pads Area

Solder Mask and Silkscreen

NO.	ITEM	Standard Capabilities	Special Capabilities
45	Solder Mask Thickness	15um +/-5um
46	Solder Mask Tolerance For Opening Size	+/-0.05mm	+/-0.02mm
47	Solder Mask Tolerance For Opening Position	0.1mm	+/-0.02mm
48	Minimum Silkscreen line width	0.13mm
49	Minimum Silkscreen Gap	0.2mm
50	Minimum Silkscreen Position Tolerance	+/-0.3mm
51	Minimum Silkscreen height	0.8mm
52	Minimum Solder Mask Bridge	0.13mm

Board Outline & Stiffeners

NO.	ITEM	Standard Capabilities	Special Capabilities
53	Board Outline Tolerance with Steel Die	±0.1 mm	±0.03mm
54	Board Outline Tolerance with Knife Die	±0.2 mm
55	Minimum Gap Between Drilling and Board Edge	≥0.5 mm
56	PSA Position Tolerance	±0.2 mm
57	Stiffeners Position Tolerance	±0.2 mm

FPC E-Test

NO.	ITEM	Standard Capabilities	Special Capabilities
58	Test Voltage	10-50V
59	Insulation Test Impedance	≥10MΩ
60	Conduction Test Impedance	≤50Ω
61	Impedance Tolerance	10%

FPC Physical Property

NO.	ITEM	Standard Capabilities	Special Capabilities
62	Solderability Test	245±5℃, 3 Seconds For One Time, Soldering Area≥95%
63	Thermal Shock Test	288±5℃, 10 Seconds Per 3 Times, No Delamination and No Bubbles
64	FCCL Peel Strength	≥0.8kgf/㎠ (1cm width sample)
65	Coverlay Peel Strength	≥0.8kgf/㎠ (1cm width sample)
66	Stiffeners Peel Strength	0.15 N/mm (Hot-Press Adhesive) 0.49 N/mm (PSA Adhesive)