Helen Frankenthaler PCB Circuit Board R&D Center

flex pcb layer thickness

Rigid Flex PCB

rigid flex pcb prototyping product clean

Rigid Flex PCB

Board Dimensions

DescriptionProductionAdvanced
Max. Finish Board Size16″X20″18″X26″
min. Finish Board Size0.2″x0.2″0.15″*0.15″
Max. Board Thickness0.250″(+/-10%)0.280″(+/-8%)
Min. Board Thickness0.016″(+/-10%) For 4L0.016″(+/-10%) For 4L

Lamination

DescriptionProductionAdvanced
Layer Count4~42L50L
Layer to Layer Registration+/-4mils+/-3mils

Drilling

DescriptionProductionAdvanced
Min. Drill Size6mils5mils
Min. Hole to Hole Pitch20mils(0.5mm)18mils(0.45mm)
True position Tolerance+/-3mils+/-2mils
Slot Diameter Tolerance+/-3mils+/-2mils
Min gap from PTH to track inner layers6mils4mils
Min gap from PTH to the border of rigid flex30mils20mils
Min. PTH Hole edge to PTH Hole edge space10mils8mils

Plating

DescriptionProductionAdvanced
Max. Aspect Ratio6:18:1
Cu Thickness in Through hole>1mils>1mils
Plated hole size tolerance+/-2mils+/-1.5mils
NPTH hole tolerance+/-2mils+/-1mils
Via in pad Fill MaterialEpoxy resin/Copper pasteEpoxy resin/Copper paste

Layer

DescriptionProductionAdvanced
Min. Trace/Space3mils / 3mils2.5mils / 2.5mils
Min. pad over drill size6mils4mils
Max. Copper thickness1~2 oz3 oz
Line/ pad to board edge6mils4mils
Min gap from Copper to the border of rigid flex15mils10mils
Line Tolerance+/-20%+/-10%

Metal Finish

DescriptionProductionAdvanced
HASL50-1000u”50-1000u”
HASL+Selective Hard goldYesYes
OSP8-20u”8-20u”
Selective ENIG+OSPYesYes
ENIG(Nickel/Gold)80-200u”/2-9 u”250u”/ 10u”
Immersion Silver6-18u”6-18u”
Hard Gold for Tab10-80u”10-80u”
Immersion Tin30u”min.30u” min.
ENEPIG (Ni/Pd/Au)125u”/4u”/1u” min.150u”/8u”/2u” min.
Soft Gold (Nickel/ Gold)200u”/ 20u”min.200u”/ 20u”

Coverlay

DescriptionProductionAdvanced
Thickness(Min) (PI / ADH)0.5mils / 1mils0.5mils / 1mils
dam width20mils15mils
registration tolerance+/-15mils+/-10mils

Solder Mask

DescriptionProductionAdvanced
S/M Thickness0.4mils min.3mils max.0.4mils min.3mils max.
Solder dam width4mils3mils
S/M registration tolerance+/-2.5mils+/-2mils
S/M over line3.5mils2mils

Legend

DescriptionProductionAdvanced
Min. Space to SMD pad6mils4mils
Min. Stroke Width6mils5mils
Min. Space to Copper pad6mils4mils
Standard ColorWhite or YellowN/A

Electrical Testing

DescriptionProductionAdvanced
Max. Test Points30000 Points30000 Points
Smallest SMT Pitch20mils16mils
Smallest BGA Pitch20mils16mils

Laser Rout (LPKF)

DescriptionProductionAdvanced
Min. Rout to copper space6mils4mils
Rout tolerance+/-2mils+/-2mils

NC Rout

DescriptionProductionAdvanced
Min. Rout to copper space8mils4mils
Rout tolerance+/-4mils+/-3mils

Impedance controll

DescriptionProductionAdvanced
Impedance controll+/-8%+/-5%

EMI

DescriptionProductionAdvanced
PC-5500&PC-5600YesYes

Stiffener

DescriptionProductionAdvanced
PIYesYes
FR4YesYes
MetalYesYes

Conductive & thermal adhesive

DescriptionProductionAdvanced
3M TypeYesYes

Eccobond

DescriptionProductionAdvanced
Eccobond over Flex width60mils60mils

GET IN TOUCH

Flashline EMS is an innovative AI driven electronics manufacturing service (EMS) partner to leading OEMs, offering high-quality design, prototype, and full-scale production for anysorts of complex printed circuit boards assemblies. Flashline EMS has years of experience in the industry, resulting in vast expertise in printed circuit board manufacturing, assembly and Box build.

Flashline EMS is over 100,000 square feet state of art, brand new manufacturing facility with capacity to grow over 10 SMT lines aimed to serve prototype to high-mix volume for the customers globally.