Your advantages
Semi-flexible PCBs are suitable for double-sided and multi-layer applications. The semi-flexible structure offers significant cost advantages over classic rigid-flex PCBs and is well suited for static bending stress during assembly and installation.
The Semiflex printed circuit board belongs to the group of 3D printed circuit boards. The technology is suitable for double-sided and multilayer PCBs. The semi-flexible structure also offers significant cost advantages over classic rigid-flex PCBs and is well suited for static bending stress during assembly and installation.
In addition to their attractiveness in terms of price and good static bending stress during assembly and installation, semi-flexible PCBs are characterized by the following parameters:
The manufacturing process of a semi-flexible PCB is simple and is based on the process chain of a standard rigid FR4 PCB. A flexible cover film or a flexible lacquer is applied over the desired bending area instead of the standard solder resist. At the end of the production process, a deep cut is made underneath this area, which reduces the thickness of the PCB in the bending area until the material can be bent without any problems.
Materials Polyimide / FR4 Number of layers 2-10 PCB thickness 0.6 - 3.2 mm End copper 18, 35, 70 µm Ladder structures Depending on the end copper according to Design Compass Smallest drill diameter 0.20 mm Solder resist masks See general technical specifications Surfaces See general technical specifications Contour production Milling
Scoring / retaining bars Bending radii≥ 5 mm Bending angle≤ 180°
Solder resist masks
