Helen Frankenthaler PCB Circuit Board R&D Center

FR4 HDI PCB for Automotive Electronics

manufacturing fr4 pcb board interior electronics | Rocket PCB

Rocket PCB manufacturing fr4 pcb board interior electronics

Name:HDI PCB Material:FR4 Board thickness:1.6mm Surface treatment:Immersion Gold, ENIG, Immersion silver/Sn, HASL, LF-HASL Technology:Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias Payment:L/C,T/T,WesternUnion Certification:UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)Delivery Term:DDU, FOB, CFA, CIF, CPT, EXW Price Get Latest Price

Product Information of Rocket PCB manufacturing fr4 pcb board interior electronics

Product Advantage
  • With the pursuit of excellence, Rocket PCB is committed to showing you unique craftsmanship in HDI PCB
  • As one of Rocket PCB's main products, HDI PCB has wide applications.
  • The quality of this product is ensured by strict management system and complete quality control system.
  • We can provide you one-stop solution and effective suggestions after you buy our pcb board.
  • Rich in talent, Rocket PCB gathers a group of professional talents who are engaged in R&D, technology, marketing, and management.
High-density Interconnect PCBs

To provide high-quality HDI PCB, the state-of-the-art production equipment is adopted by Rocket PCB Solution Ltd. Our engineers adopt FR4 as its main material. It has met the industrial design requirements. It better meets the market demands. The adoption of LDI, Laser etching allows to deliver leading production efficiency. Due to 4+N+4 structure capability, it gets such merits as improves the wiring density of the inner signal layer, great help to Power integrity and signal integrity. It mainly serves communication, medical, military, security, industrial, automotive fields. It is approved by UL, SGS, ROHS, ISO9001,ISO14001, TS16949. Your specific requirements on HDI PCB are accepted. All your demand can be satisfied at www.rocket-pcb.com/

Rocket PCB focuses on high-tech and high-mixed PCB and is active in the electronic manufacturing industry. We have focused on this industry for more than 10 years years. Our product list includes rigid, rigid-flex, HDI, any layer, Flex, large-size, embedded, RF, LED, backplane, metal substrate, ceramic substrate, IC structure, high-frequency, heavy copper. Industry-leading and years of experience in the HDI field Our mission is to continually raise the bar of customer experience by sticking to the business principle of 'Service creates value, service wins respect and service builds brand '. Here at https://www.frankenthalerfoundation.org more details can be found.

OUR STRENGHS

In Rocket, with advanced production equipment, excellent PCB solutions and complete testing methods, we have specialists working on their particular fields with the thorough mastery of their particular discipline in each of the production facilities. Training, as well as technical exchanges, are held frequently, tackling problems in key technologies and configuring scheme of equipment and allowing professionals to get up to speed on the essential tools that many organizations value today in the manufacturing industry. Thanks to those above, we have greatly improved the strength and won international reputation.

SPECIALIZED MANUFACTURING
  • Conductive materials and core-to-core bonding
  • Embedded components
  • RF connector attachment
  • Laser direct imaging (LDI)
  • Laser etching
  • Laser forming
  • Multi-level cavity construction
  • Plated cavities and edges
  • Composite/hybrid Structures
  • N+N dual press-fit
  • Dual-drill
  • Bonding on metal core
  • Bulid-up HDI
  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

CAPABILITIES
  • 3mil line and space
  • 4mil laser defined vias
  • 6mil chip-on-board
  • 6mil mechanically drilled vias
  • Conductive and non-conductive via fill
  • Dual backdrilling
  • Sequential lamination
  • Mixed dielectric
  • Heatsink Bonding
  • Heavy copper/thermal vias
  • Blind/buried vias
  • Stacked and staggerd microvias
EXTENSIVE ANALYTICAL TESTING
  • Design Rules Check(DRC)
  • Electrical Testing
  • Automated Optical Inspection(AOI)
  • X-Ray
  • Plating thickness testing
  • Metalized vias inspection
  • Thermal shock testing
  • Surface peelability testing
  • Impedance control testing
  • 100% visual inspection
  • Solderability testing
  • Ionic cleanliness testing
  • Metallographic microscopic analysis
  • High voltage testing
  • Insulating resistance testing
FEATURES
  • PTFE
  • High speed/low loss
  • High temperature
  • Low CTE
  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
  • Combination sur