Helen Frankenthaler PCB Circuit Board R&D Center

FR4 High Power PCB for Communication Equipment

18 Layer FR4 Multilayer PCB For High Frequency Communications Test Equipment

high frequency pcb manufacturing wire harness

18 Layer FR4 Multilayer PCB For High Frequency Communications Test Equipment

Pingxiang Lianjin Cheng Technology Co., Ltd

Product Details

Detail Information
AttributeSpecification
Place of OriginChina
CertificationUL ISO IATF1
Layer18L
Thickness5.7mm
Surface FinishImmersion Gold
Min. Hole Size0.2mm
ApplicationCommunication
Packaging DetailsCarton
Product Highlights
  • 18 Layer FR4 Multilayer PCB
  • Communications Test Equipment Multilayer PCB
  • High Frequency Communications Multilayer PCB

Product Description

Specification
ParameterValue
Layer18L
Thickness5.7mm
Copper Weight I/L, O/L1OZ, 1OZ
Surface FinishImmersion Gold
Min. Hole Size0.2mm
Min.Trace Width/Spacing0.15mm/0.2mm
ApplicationCommunication
NoteCommunication Test Board
Product Tags
  • Communications PCB Board
  • Communication Printed Circuit Board
  • Communications Circuit Board

Contact Information

Pingxiang Lianjin Cheng Technology Co., Ltd

E-mail: pcb@frankenthalerfoundation.org

Work Time: 08:00-23:00

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