fr4 pcb thickness tolerance

Multi-layer PCB

Layer Count: 16

Thickness: 2.0 mm

Min. Hole: 8.0 mil

Aspect Ratio: 9.84:1

Min. Trace/Space: 6.0/6.0 mil

Surface Finish: ENIG

Additional Features:

• Controlled Impedance
• Resin Filled Vias

Multi-layer PCB

Layer Count: 18

Thickness: 2.62+/-0.157 mm

Panel Size: 182 * 180 mm

Min. Hole: 9.84 mil

Aspect Ratio: 10.48:1

Min. Trace/Space: 3.94/4.9 mil

Controlled Impedance: Yes

Surface Finish: ENIG

Application: Medical

Multi-layer PCB

Layer Count: 14

Thickness: 1.60 mm

Panel Size: 318.26 * 180 mm

Min. Hole: 8.0mil

Aspect Ratio: 7.87:1

Min. Trace/Space: 3.0/3.06 mil

Surface Finish: ENIG

Additional Features:

• 8mil BGA, Resin Fill
• Controlled Impedance

Application: Security

Multi-layer PCB

Layer Count: 16

Thickness: 2.14 mm

Panel Size: 269.00 * 172.62 mm

Min. Hole: 12.00 mil

Aspect Ratio: 7.02:1

Min. Trace/Space: 22.00/34.04 mil

Surface Finish: ENIG

Application: Communication

Multi-layer PCB

Layer Count: 18

Thickness: 2.36 mm

Panel Size: 304.96 * 186.50 mm

Min. Hole Size: 12.00 mil

Aspect Ratio: 7.74:1

Min. Trace/Space: 3.0/8.0 mil

Surface Finish: ENIG

Application: Consumer Electronics

Multi-layer PCB

Layer Count: 28

Thickness: 5.03 mm

Panel Size:433.06*373.20 mm

Min. Hole: 20.62 mil

Aspect Ratio: 9.60:1

Min. Trace/Space: 6.0 /8.32 mil

Surface Finish: ENIG

Additional Features:

• Backplane

Application: Industrial Control

Multi-layer PCB

Layer Count: 22

Thickness: 5.00 mm

Panel Size:403.50 * 404.50 mm

Min. Hole: 24.06 mil

Aspect Ratio: 8.18: 1

Min. Trace/Space: 10.00/10.00 mil

Surface Finish: ENEPIG

Additional Features:

• Stepped Hole

Application: Semiconductor Test

Multi-layer PCB

Layer Count: 16

Thickness: 3.8 mm

Min. Hole: 10 mil

Aspect Ratio: 14.96:1

Min. Trace/Space: 4.00/3.91 mil

Cu Thk.: 5/2/1/…/1/2/5 OZ

Additional Features:

• 1-3 & 14-16 stacked microvias
• 2 pressing cycles
• Resin Fill 2 cycles
• Depth-controlled drill
• Blind Slot Routing