In response to market requirements, Hemeixinpcb also offers production of its core HDI PCB technology in combination with flexible PCBs. To make this possible, Hemeixinpcb can offer rigid-flex and flexible PCBs and HDIs for high-reliability applications, with features down to 25 µm and flexible pcb dielectric core down to 25 µm. With the revolution in portable communications’ products over the last decade, flex PCB manufacturing has become a preferred design solution for both complex, three-dimensional product assembly and advanced component surface mounting demands.
