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Layer : 4
Board thickness: 1.6 mm
Material: FR4 TG170
Out layer copper thickness: 2 oz
Inner layer copper thickness: 3oz
Surface treatment: Immersion gold 2U”
Application: Consumer electronics
Minimum hole: 0.15 mm
Minimum line width: 3.6mil
line spacing: 4.2 mil
Layer : 8
Board thickness: 2.0 mm
Material: ITEQ 180
Construction: 2+4+2 HDI PCB
Out layer copper thickness: 3 OZ
Inner layer copper thickness: 5 OZ
Surface treatment: Immersion gold 2U”+ OSP
Application: Communication
Minimum hole: 0.1 mm
Minimum line width: 3 mil
Layer : 10
Board thickness: 2.6mm
Material: EM-825
Construction: 3+4+3 HDI PCB
Out layer copper thickness: 6 OZ
Inner layer copper thickness: 2 OZ
Surface treatment: ENIG
Application: Military
Minimum blind/Buried hole: 0.1 mm/0.15mm
line spacing: 3.6mil
Layer : 18
Board thickness: 1.2mm
Material: ISOLA
Construction: 2+16+2 HDI PCB
Out layer copper thickness: 3OZ
Application: Automotive Electronics
Minimum blind/Buried hole: 0.15 mm/0.1mm
Minimum line width: 3.3mil
line spacing: 3.3mil
Layer : 26
Board thickness: 3mm
Construction: 3+20+3 HDI PCB
Out layer copper thickness: 6OZ
Inner layer copper thickness: 6OZ
Application: Industrial control
Minimum blind hole: 0.1mm
Minimum line width: 3mil
line spacing: 3.2mil
Layer : 32
Board thickness: 6mm
Material: KB 6160
Out layer copper thickness: 2OZ
Inner layer copper thickness: 3OZ
Surface treatment: ENIG 3U
Minimum hole: 0.15mm
Minimum line width: 3.1mil
Address:9F,Tower A,Fencheng Zhigu Building,Tiezai Road 60, Xixiang Street, Bao’an District,Shenzhen,China
Tel: 86 0755 23575120
Email: pcb@frankenthalerfoundation.org
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