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Stackup for 22-layer 4-order Rogers High-frequency HDI PCB

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Stackup for 22-layer 4-order Rogers High-frequency HDI PCB

PCBWay, as a leading manufacturer of high-complexity HDI PCBs, not only possesses the capability to develop and manufacture HDI PCB with FR4 with more than 5-order, high-speed, or high-frequency materials, but also has the ability to produce specialized products, such as PCBs with ultra-high layer count and high-frequency.

Next, let's take a look at the product information of PCBWay's latest 22-layer 4-order Rogers high-frequency HDI PCB with pure lamination and ultra-high aspect ratio.

Stack-Up and Parameter Overview

• 22 Layer HDI PCB Stackup

• Parameter Overview

  • Number of Layers: 22
  • Board Thickness: 6.9mm
  • Minimum Hole Diameter: 0.45mm
  • Number of Laminations: 5
  • Via Process: vias filled with resin
  • Aspect Ratio: 15:1
  • Impedance: 50Ω ± 3Ω
  • Trace Width/Spacing: 4mil/4mil
  • BGA Diameter: 8mil (16 groups), each group corresponding to 12 RF trace

Application Fields and Frequency Bands

  • Application Fields: 5G Base Station
  • Frequency Bands: 26GHZ

Product Photos