Blind Buried Circuits Inc, manufactures High-frequency PCBs, mainly used for high-speed communications, telecommunications, and RF microwave technology. The purpose of using HF technology (HF PCBs) for communication devices is to offer a fast signal flow and 100 GHz or more frequency range based on the type of material.
Blind Buried Circuits Inc, offers manufacturing of Hi-Speed circuits with most materials containing lower dielectric constant (Dk), lower dissipation factor (Df), and low coefficient of thermal expansion, which transmits electromagnetic waves with minimal losses in signals.
To achieve the optimal performance of high frequency or rf PCB design, our experienced IPC-certified production engineers keep the Hi-Speed Materials in Stock and also suggest alternate materials by considering the purpose of electronic device application, optimal operating frequency signal requirement, and lamination resin loss (etch & fudge) factors based on layer counts requirements in given data stack up.
Regarding the cost & availability of substrate (material), it is well known that Exotic materials like Rogers, Nelco, Megtron, FR408 HR, and Teflon are some of the rare and expensive materials used to fabricate high-frequency PCBs and are not easily available with other manufacturer’s. However, we make all those factors possible for our customers without keeping a hold on manufacturing.
Generally, FR4 substrate doesn’t meet the hi-speed frequencies and can also under the limitations up to 1.6 GHz, due to which FR-4 considerably drops the signal speed. In comparison, Rogers, Nelco, Megtron, and Teflon have low Dk, Df, and water absorption, making them survive in the most challenging environments.
Considering the frequency requirements, we use different substrates and Teflon for frequencies above 10 GHz. Our approved suppliers for high-frequency materials include Arlon, Taconic, Nelco, Isola, Rogers, and Teflon. They all specialize in manufacturing low Dk and Df materials for high-frequency boards.
Do reach out to our team for a hf/rf pcb quote by providing the stack-up requirement
