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Rogers 3003 Gold Plated PCB

Rogers 3003 Gold Plated High Level Quality PCB Circuit Boards

Quick detail:

  • Material: High frequency rogers 3003
  • Layer: 2
  • Surface finish: Gold plated
  • Board size: 6*3cm
  • Thickness: 0.8mm
  • Copper weight: 0.5OZ
  • Name: rogers 3003 gold plated high level qulity PCB printed circuit boards

Rogers - High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminat ( not PTFE ) designed for performance sensitive, high volume commercial applications

Rogers 3003 PCB:

The RO3003 from Rogers Corp. is a ceramic-filled PTFE composite/laminate for use in commercial microwave and RF applications. It features excellent stability with a dielectric constant of 3 up to 40 GHz at room temperature. The material has a dissipation factor (Df) of 0.0013 at 10 GHz and is ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

By far the most commonly used is the Rogers RO4000 series of high frequency materials.

RO4350B laminate is a hydrocarbon/ceramic base, which can be manufactured using standard FR-4 type multilayer processes, making it not only popular but economical to manufacture. Low dielectric loss is the major appealing characteristic of this material.

Multilayers can be constructed of a “pure package” using Rogers 4450 prepreg, or by using standard FR-4 prepreg. Popular constructions limit the Rogers material to the “caps” of the stackup thereby managing overall cost by using the material only where it is required, and filling the remainder of the board with standard FR-4 cores/prepreg.

PTFE, commonly known as “Teflon” is another fairly common callout for this genre’s material requirements. There are many different formulations and laminates such as Rogers 3000 series ceramic-filled PTFE composites, R/T Duroid 5870 and 5880 glass microfiber reinforced PTFE, etc. They can be very difficult in multilayer configurations however, as some require the use of high temperature bonding films or adhesives. The old saying that “nothing likes to stick to Teflon!” sometimes holds true! But their extremely low loss characteristics make them ideal for exacting stripline and microstrip circuit designs.

PCB basic information:

Oneseine Technology Go.,LTD

SeqItemcapability
1Base MaterialFR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,Teflon,PI ,etc
2Layers1-40 (≥30 layers needs review )
3Finished inner/outer copper thickness0.5-6OZ
4Finished board thickness0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL Board thickness≤1.0mm: +/-0.1mm Board thickness>2.0mm: +/-8%
5Max panel size≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm
6Min conductor line width/spacingInner layers:≥3/3mil Outer layers:≥3.5/3.5mil
7Min hole sizeMechanical hole: 0.15mm Laser hole: 0.1mm Drilling precision: first drilling First drilling: 1mil Second drilling: 4mil
8WarpageBoard thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5%
9Controlled Impedance+/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review)
10Aspect Ratio15:01
11Min welding ring4mil
12Min solder mask bridge≥0.08mm
13Plugging vias capability0.2-0.8mm
14Hole tolerancePTH: +/-3mil NPTH: +/-2mil
15Outline profileRout/ V-cut/ Bridge/ Stamp hole
16Solder mask colorGreen,yellow,black,blue,red,white,matte green
17Component mark colorwhite,yellow,black
18Surface treatmentOSP: 0.2-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.5um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’
19E-TestFlying probe tester : 0.4-6.0mm,max 19.6*23.5inch Min spacing from test pad to board edge : 0.5 mm Min conductive resistance : 5 Ω Max insulation resistance : 250 MΩ Max test voltage : 500 V Min test pad diameter: 6 mil Min test pad to pad spacing: 10 mil Max test current : 200 MA
20AOIOrbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch