High Power PCB Automated PCB Assembly

PCB Manufacturing & Assembly Capabilities

rigid flex pcb prototyping pcba assembly

PCB Manufacturing & Assembly Capabilities

Know JLCPCB's Capabilities & Get your PCBs Built Fast

PCB Specifications

Features	Capability	Description	Patterns
Layer count	1-32 Layers	The number of copper layers in the PCB
Controlled Impedance	4/6/8/10/12/14/16/18/20/.../32 layers	User Guide to the JLCPCB Impedance Calculator JLCPCB Impedance Calculator
Impedance Tolerance	±10%
Material	FR-4 Grade A laminates from suppliers including Nan Ya, KB, Shengyi and etc.		PCB Capability - Material
Aluminum-Core	1-layer Aluminum-core PCBs		PCB Capability - Material
Copper-Core	1-layer copper-core PCBs with direct heatsink contacts to core (≥ 1 × 1 mm)		PCB Capability - Material
RF PCB	1 oz copper, 2-layer RF PCBs with Rogers and PTFE cores		PCB Capability - Material
FR-4 Dielectric Constants	4.5 (2-Layer PCB)7628 Prepreg 4.4 3313 Perpreg 4.1 2116 Perpreg 4.16
Maximum Dimensions	FR4 PCB: 670 × 600 mm Rogers / PTFE Teflon PCB: 590 × 438 mm Aluminum PCB: 602 × 506 mm Copper PCB: 480 × 286 mm	These limits apply to PCBs with thickness ≥ 0.8 mm. The thinner FR4 PCBs are 500 × 600 mm maximum. 2-layer FR4 PCBs can reach a maximum size of 1020 × 600 mm.	PCB Capability - Maximum Dimensions
Minimum Dimensions	Regular: 3 × 3 mm. Castellated / Plated Edges: 10 × 10 mm.	These limits apply to PCBs with thickness ≥ 0.6 mm. Manual review required for thinner PCBs. Panelization is recommended for small-sized boards.
Dimension Tolerance	±0.1mm	±0.1mm(Precision) and ±0.2mm(Regular) for CNC routing, and ±0.4mm for V-scoring
Thickness	0.4 – 4.5 mm	Thickness for FR4 are: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm (2.5 mm and above are for 12+ layer PCBs only)	PCB Capability - Thickness
Thickness Tolerance (Thickness≥1.0mm)	± 10%	e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)
Thickness Tolerance (Thickness<1.0mm)	± 0.1mm	e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
Finished Outer Layer Copper	2-layer: 1 oz / 2 oz / 2.5 oz / 3.5 oz / 4.5oz Multi-layer: 1 oz / 2 oz		PCB Capability - Finished Outer Layer Copper
Finished Inner Layer Copper	0.5 oz / 1 oz / 2 oz	Finished copper weight of inner layer is 0.5oz by default.	PCB Capability - Finished Inner Layer Copper
Soldermask	Green, Purple, Red, Yellow, Blue, White, and Black.	We use LPI (Liquid Photo Imageable) solder mask. This is the most common type of mask used today. Heat-cured ink soldermask is usually found on low-cost, single-sided PCBs.
Surface Finish	HASL (leaded / lead-free), ENIG, OSP (copper core boards only)	FR4 has all three finishes available, 6+ layers and RF boards only have ENIG. Aluminium core boards only have HASL. Copper core boards only have OSP.

Drilling

Features	Capability	Description	Patterns
Drill Diameter	1-layer: 0.3 – 6.3 mm 2-layer: 0.15 – 6.3 mm Multilayer: 0.15 – 6.3 mm	Holes with diameter ≥ 6.3 mm are CNC routed from a smaller drilled hole. Min. drill diameter for 2- or more-layer PCBs is 0.15 mm (more costly!) Min. drill diameter for aluminum-core PCBs is 0.65 mm Min. drill diameter for copper-core PCBs is 1.0 mm	PCB Capability - Drill Diameter
Hole size Tolerance (Plated)	Through-holes: +0.13 / -0.08 mm Press-fit holes：±0.05 mm (Finished hole size: 0.55-1.025mm. Multilayer ENIG boards only. Mention the specific holes in PCB Remark)	e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.	PCB Capability - Hole size Tolerance (Plated)
Hole size Tolerance (Non-Plated)	±0.2mm	e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable.	PCB Capability - Hole size Tolerance (Non-Plated)
Average Hole Plating Thickness	18μm
Blind/Buried Vias	Not supported	Currently we don't support Blind/Buried Vias, only make through holes.	PCB Capability - Blind/Buried Vias
Min. Via hole size/diameter	0.15mm / 0.25mm	1-layer (NPTH only): 0.3 mm hole size / 0.5 mm via diameter 2-layer:0.15mm hole size/0.25mm via diameter Multilayer: 0.15 mm hole size / 0.25 mm via diameter ① Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size. ② Preferred Min. Via hole size: 0.2mm	PCB Capability - Min. Via hole size/diameter
Min. Non-plated holes	0.50mm	Please draw NPTHs in the mechanical layer or keep out layer.	PCB Capability - Min. Non-plated holes
Min. Plated Slots	0.5mm	The minimum plated slot width is 0.5mm, which is drawn with a pad. The length of the slot should be at least 2 times of the width.	PCB Capability - Min. Plated Slots
Min. Non-Plated Slots	1.0mm	The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GM1 or GKO)	PCB Capability - Min. Non-Plated Slots
Via Hole-to-Hole Spacing	0.2mm		PCB Capability - Via Hole-to-Hole Spacing
Pad Hole-to-Hole Spacing	0.45mm		PCB Capability - Pad Hole-to-Hole Spacing
Min. Castellated Holes	0.5mm	Castellated holes are metalized half-holes on PCB edges, commonly used on daughter boards to be soldered onto carrier PCBs. ① Hole diameter (Φ): ≥ 0.5 mm ② Hole to board edge (L): ≥ 1 mm ③ Hole to hole (D): ≥ 0.5 mm ④ Min. PCB size：10 × 10 mm ⑤ Min. PCB thickness: 0.6 mm	PCB Capability - Min. Castellated Holes
Plated Edges	10 x 10mm	Plated edges are copper-plated and ENIG treated. HASL is not supported. ① Min. PCB size: 10 × 10 mm ② Min. PCB thickness: 0.6 mm ③ At least 3 breaks (more for larger PCBs) in the edge plating are required for support tab connections	PCB Capability - Plated Edges
Blind Slot	① Blind slot width (W): ≥1.0mm ② Blind slot depth (D): ≥0.2mm ③ Blind slot annular width (A): ≥0.3mm (The pad width of PTH blind slots) ④ Safety distance (S): ≥0.2mm (The distance from NPTH blind slots to pad/traces/copper plane) ⑤ Blind slot remaining thickness (R): ≥0.2mm (The distance from the bottom of the blind slot to the nearest inner copper layer/surface substrate) ⑥ Supports 2-32-layer FR4 boards with a thickness of ≥0.8mm		PCB Capability - Blind Slot
Rectangular Holes / Slots	Not supported	Rectangular holes and slots without rounded corners are not supported.	PCB Capability - Rectangular Holes / Slots

Traces

Features	Capability	Description	Patterns
Min. track width and spacing (1 oz)	0.10 / 0.10 mm (4 / 4 mil)	1- and 2-layer: 0.10 / 0.10 mm (4 / 4 mil) Multilayer: 0.09 / 0.09 mm (3.5 / 3.5 mil). 3 mil is acceptable in BGA fan-outs.	PCB Capability - Min. track width and spacing (1 oz)
Min. track width and spacing (2 oz)	0.16 / 0.16 mm (6.5 / 6.5 mil)	2-layer: 0.16 / 0.16 mm (6.5 / 6.5 mil) Multilayer: 0.16 / 0.20 mm (6.5 / 8 mil)
Min. track width and spacing (2.5 oz)	2 layer: 0.2/0.2mm(8mil/8mil)
Min. track width and spacing (3.5 oz)	2 layer: 0.25/0.25mm(10mil/10mil)
Min. track width and spacing (4.5 oz)	2 layer: 0.3/0.3mm(12mil/12mil)
Track width tolerance	±20%	e.g. For a 0.1 mm track, the finished track width ranges from 0.08 and 0.12 mm.
PTH annular ring	≧0.20mm	2-layer: 1 oz: Recommended 0.25 mm or above; absolute minimum 0.18 mm 2 oz: 0.254 mm or above Multilayer: 1 oz: Recommended 0.20 mm or above; absolute minimum 0.15 mm 2 oz: 0.254 mm or above	PCB Capability - PTH annular ring
NPTH pad annular ring	≧0.45mm	Recommended 0.45 mm or more. This is to allow a 0.2 mm ring of copper to be removed around the hole for the sealing film to attach. Pad sizes smaller than the recommended value can result in the annular ring being very thin or completely missing.	PCB Capability - NPTH pad annular ring
BGA	0.25mm	① BGA pad diameter ≥ 0.25 mm ② BGA pad to trace clearance ≥ 0.1 mm (min. 0.09 mm for multilayer boards) ③ Vias can be placed within BGA pads using filled and plated-over vias	PCB Capability - BGA
Trace coils	0.15/0.15mm	Minimum trace width/clearance: 0.15/0.15mm, when traces are covered by solder mask (1oz). Minimum trace width/clearance: 0.25/0.25mm, when traces are NOT covered by solder mask (1oz). ENIG only(high risk of short circuit with HASL)	PCB Capability - Trace coils
Hatched grid width and spacing	0.25 mm		PCB Capability - Hatched grid width and spacing
Same-net track spacing	0.25mm		PCB Capability - Same-net track spacing
Inner layer via hole to copper clearance	0.2mm		PCB Capability - Inner layer via hol