Product Introduction:
20 Layers High Layer High Fequency PCB Count HDI PCB Circuit Board
Layer Count and Structure:Supports designs from 4 to 20 layers, utilizing HDI arbitrary-order blind and buried via technology to increase wiring density. Minimum aperture diameters of 0.15mm for mechanical drilling and 0.1mm for laser drilling ensure high-density interconnects.
Board Material Selection:High-frequency materials such as Rogers 4350B (dielectric constant stability ≤3%), Panasonic Megtron, or Isola series, with Dk values of 3.0-10.2 and Df as low as 0.0015, reduce signal attenuation.
Trace Width and Spacing:Minimum 3/3 mil (0.075mm), supporting ultra-fine line layouts and meeting the requirements of highly integrated circuits.
High-Frequency Performance: Dielectric constant fluctuation must be ≤3% at 10GHz, and signal impedance fluctuation must be ≤±3Ω at 40GHz, suitable for millimeter-wave radar and 5G applications, reducing signal reflections and crosstalk. Optimized Integrity: By shortening signal paths and implementing 3D electromagnetic field simulation, radio frequency interference (RFI) and electromagnetic interference (EMI) are reduced, improving transmission efficiency by 30%.
Low-Loss Design:Laser drilling achieves a hole wall roughness of <25μm, combined with stepped blind and buried vias to minimize signal attenuation and improve reliability.
Below is the stack up.
