Helen Frankenthaler PCB Circuit Board R&D Center

high speed fr4 thermal conductivity

IS410 FR-4 epoxy Laminate and Prepreg | Isola Group

teflon high temperature pcb pcba assembly

Thermal Performance

Tg: 180°C

Td: 350°C

Electrical Performance

Dk: 3.97

Df: 0.0200

Industry Approvals

IPC-4101 /21/24/26/121/124/129

UL - File Number E41625

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

Attributes

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
    • 6x 288°C solder float capable
  • Processing Advantages
    • FR-4 process compatible

Production & Manufacturing

Currently manufactured in Asia, Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Typical Values

PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC180°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss350°C2.4.24.6
Time to Delaminate by TMA (Copper removed)A. T260 B. T28850 10Minutes
Z-Axis CTEA. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)55 250 3.5ppm/°C ppm/°C %
X/Y-Axis CTEPre-Tg11ppm/°C
Thermal Conductivity0.5W/m·KASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)A. Unetched B. EtchedPassPass Visual
Dk, PermittivityA. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz3.96 3.90 3.97 3.87 3.87—
Df, Loss TangentA. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz0.0149 0.0189 0.0200 0.0230 0.0230—
Volume ResistivityA. After moisture resistance B. At elevated temperature8.0 x 10 8 3.6 x 10 8MΩ-cm
Surface ResistivityA. After moisture resistance B. At elevated temperature8.0 x 10 6 4.5 x 10(8)MΩ
Dielectric Breakdown>50kV—
Arc Resistance129Seconds—
Electric Strength (Laminate & laminated prepreg)44 (1100)kV/mm (V/mil)—
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A ASTM D3638
Peel StrengthA. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions1.14 (6.5) 1.225 (7.0) 1.14 (6.5) 0.90 (5.1)N/mm (lb/inch)
Flexural StrengthA. Length direction B. Cross direction570 (82.6) 458 (66.4)MPa (kpsi)
Tensile StrengthA. Length direction B. Cross direction420 (60.9) 316 (45.8)MPa (kpsi)
Poisson's RatioA. Length direction B. Cross direction0.175 0.143—
Moisture Absorption0.20%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)130°CUL 796

The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site for more details.

Revisions:

A: Initial release - 4/17

B: Corrected units for Flexural and Tensile Strength - 8/18

C: Change MOT to RTI 5/19

D: Removed Asia as Production site 9/24

Constructions

Core Data
ConstructionResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz500 MHz1 Ghz2 GHz5 Ghz
1x10670.0%0.00200.0513.59 0.0178
1x108057.0%0.00250.0643.83 0.0158
1x108063.0%0.00300.0763.71 0.0167
1x211346.0%0.00300.0764.08 0.0141
1x211351.0%0.00350.0893.96 0.0171
2x10665.0%0.00350.0893.68 0.0149
1x211645.0%0.00400.1024.10 0.0139
1x211649.0%0.00430.1094.01 0.0134
106/108060.0%0.00430.1093.77 0.0163
1x165242.0%0.00500.1274.17 0.0156
106/211356.0%0.00530.1353.85 0.0152
1080/211353.0%0.00600.1523.92 0.0133
2113/211651.0%0.00700.1783.96 0.0150
1x762841.0%0.00700.1784.20 0.0149
2x211645.0%0.00800.2034.10 0.0139
2x1080/211647.0%0.01000.2544.05 0.0142
2x165242.0%0.01000.2544.17 0.0134
2x1080/762847.0%0.01200.3054.05 0.0142
2x762842.0%0.01400.3564.17 0.0134
2x7628/211642.0%0.01800.4574.17 0.0134
3x762840.0%0.02100.5334.22 0.0131
Prepreg Data
Glass StyleResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz500 MHz1 Ghz2 GHz5 Ghz
10675.0%0.00230.0583.50 0.0186
108065.0%0.00300.0763.68 0.0171
211357.0%0.00390.0993.83 0.0158
211656.0%0.00500.1273.85 0.0156
762844.0%0.00740.1884.12 0.0137
NOTE

Revisions:

A - Original Release - 4/17

Documentation

Resource Title & SummaryDate Updated
IS410 RAILWAY Standard EN 45545-2:2020 R25 Approvals10/31/2022
IS410 RAILWAY Standard EN 45545-2:2020 R24 Approvals10/31/2022
IS410 Prepreg Supplemental11/03/2025
IS410 Laminate Supplemental11/03/2025
Isola Laminate Outgassing Data Properties03/22/2024
IS410 Laminate Safety Data Sheet01/22/2024
IS410 Prepreg Safety Data Sheet01/22/2024
IS410 Prepreg RoHS Declaration11/03/2025
IS410 Laminate RoHS Declaration11/03/2025
IS410 Processing Guide06/25/2020

Related Products

Add a Product to Compare to IS410

There was an error, please try again.

Questions? Get In Touch With Isola Today

Information from the global leads in PCB materials

The Base for Innovation™

©2026 Isola Group All Rights Reserved.