high speed fr4 wire

High Performance FR-4 for Multi-layered PWB

High Performance FR-4 for Multi-layered PWB

Product Line-up

Copper Clad Laminates	Prepregs	CCL Thickness	Prepreg Thickness
CCL-EL190T	GEPL-190T	0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50, 1.00, 1.20, 1.60mm	0.03, 0.04, 0.05, 0.06, 0.08, 0.10, 0.15, 0.20mm

Features

CCL-EL190T / GEPL-190T has a higher Tg, lower CTE properties compared to CCL-EL 190 / GEPL-190. It is available for lead free reflow process, and especially excels in through hole connection reliability for high count multilayer motherboards. And, microvias can be easily made in the prepreg layers by CO2 laser drilling.

Copper Clad Laminates	Prepregs	CCL Thickness	Prepreg Thickness
CCL-EL230T	GEPL-230T	0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50mm	0.04, 0.06, 0.10, 0.15mm

Features

CCL-EL230T / GEPL-230T excels in through hole connection reliability because of its high Tg and low CTE properties. And also, it is very suitable for high frequency circuits because of its low dielectric properties. It excels in filling to BVH and IVH because of good resin flow properties. In addition, microvias can be easily made in the prepreg layers by CO2 laser drilling, and it is available for lead free reflow process.

Typical applications

High count multilayer motherboards for internet routers, servers, base stations, switching systems and IC tester devices.

Typical properties of Materials

Item	Condition	Unit	EL190T	EL230T
Dielectric Constant	1MHz	A	4.7	4.0
Dielectric Constant	1GHz	A	4.3	3.8
Dielectric Constant	10GHz	A	4.1	3.6
Dissipation Factor	1MHz	A	0.010	0.004
Dissipation Factor	1GHz	A	0.011	0.005
Dissipation Factor	10GHz	A	0.012	0.007
Insulation Resistance	C-96/20/65	Ω	5x10^13-15	5x10^13-15
Surface Resistance	C-96/20/65	Ω	5x10^14-16	5x10^14-16
Volume Resistivity	C-96/20/65	Ω・cm	5x10^12-14	5x10^12-14
Flexural Strength	Warp	MPa	580	470
Flexural Strength	Fill	MPa	530	460
Flexural Modulus	Warp	GPa	27	22
Flexural Modulus	Fill	GPa	27	22
Tensile Strength	Warp	MPa	330	300
Tensile Strength	Fill	MPa	330	250
Young's Modulus	Warp	GPa	27	22
Young's Modulus	Fill	GPa	26	22
Poisson's Ratio	Warp	－	0.17	0.16
Poisson's Ratio	Fill	－	0.16	0.15
Glass Transition Temp.	DMA	℃	240	210
Glass Transition Temp.	TMA	℃	220	175
Glass Transition Temp.	DSC	℃	215	175
Cofficient of Thermal Expansion	Warp, Fill	ppm/℃	14	15
Cofficient of Thermal Expansion	Z (α1, α2)	ppm/℃	40/180	45/240
Thermal Conductivity	Laser Pulse Heating Method	W/m・K	0.45	0.44
Specific Heat	DSC	J/g・K	0.95	0.95
Decomposition Temp.	TG-DTA	℃	345	335
Time to Delamination	T-260	minutes	>60	>60
Time to Delamination	T-288	minutes	20	12
Time to Delamination	T-300	minutes	7	3
Peel Strength	12μ	KN/m	0.9	0.9
Peel Strength	18μ	KN/m	1.2	1.2
Peel Strength	18μ-VLP	KN/m	1.1	1.1
Specific Gravity of Resin		－	1.44	1.42
Flame Resistance	UL94	－	V-0	V-0

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