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Wholesale Best Rogers RO4534 High Frequency PCB Double Layer 20mil 0.508mm With Immersion Gold| PCB Solution Provider

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Rogers RO4534 High Frequency PCB Double Layer 20mil 0.508mm With Immersion Gold

This is a type of antenna high frequency PCB which is built on Rogers RO4534 with 20mil substrate, starting 0.5oz copper, finished with 1oz copper.

  • Item NO.: BIC-188-v110.0
  • Order(MOQ): 1-10
  • Payment: T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin: China
  • Color: White
  • Shipping Port: Shenzhen
  • Lead Time: 7-10 days

Product Detail

Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description:

This is a type of antenna high frequency PCB which is built on Rogers RO4534 with 20mil substrate, starting 0.5oz copper, finished with 1oz copper.It contains fine lines with 4mil wide and microvias with 0.2mm diameter. The surface finish on pads is immersion gold with 0.05micron gold, green solder mask and white silkscreen legends. It is a double layer board fabricated as per IPC class 2, and every 50 pieces are vacuum-packed for shipment.

PCB Specifications:

PCB SIZE 88 x 98mm=1up

BOARD TYPE Double sided PCB

Number of Layers 2 layers

Surface Mount Components YES

Through Hole Components NO

LAYER STACKUP

copper ------- 17um(0.5 oz)+plate TOP layer

Rogers RO4534 0.508mm

copper ------- 17um(0.5 oz) + plate BOT Layer

TECHNOLOGY

Minimum Trace and Space:4 mil / 4 mil

Minimum / Maximum Holes:0.2 mm / 3.5 mm

Number of Different Holes:12

Number of Drill Holes:895

Number of Milled Slots:2

Number of Internal Cutouts:3

Impedance Control:no

Number of Gold finger:0

BOARD MATERIAL

Glass Epoxy:Rogers RO4534 0.508mm

Final foil external:1.0 oz

Final foil internal:N/A

Final height of PCB:0.6 mm ±0.1

PLATING AND COATING

Surface Finish Immersion Gold, 35%

Solder Mask Apply To:Both Sides

Solder Mask Color:Green

Solder Mask Type:LPI

CONTOUR/CUTTING

Routing

MARKING

Side of Component Legend Component Side

Colour of Component Legend White

Manufacturer Name or Logo:N/A

VIA

Plated through hole(PTH), minimum size 0.2mm.

FLAMIBILITY RATING

94V-0

DIMENSION TOLERANCE

Outline dimension:0.0059"

Board plating:0.0029"

Drill tolerance:0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

Our PCB Capabilities(2022):

ParameterValue
Layer Counts1-32
Substrate MaterialRO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum SizeFlying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
Board Outline Tolerance±0.0059" (0.15mm)
PCB Thickness0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)±8%
Thickness Tolerance(t＜0.8mm)±10%
Insulation Layer Thickness0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track0.003" (0.075mm)
Minimum Space0.003" (0.075mm)
Outer Copper Thickness35µm--420µm (1oz-12oz)
Inner Copper Thickness17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)0.00295" (0.075mm)
Registration (Mechanical)0.00197" (0.05mm)
Aspect Ratio12:1
Solder Mask TypeLPI
Min Soldermask Bridge0.00315" (0.08mm)
Min Soldermask Clearance0.00197" (0.05mm)
Plug via Diameter0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance±10%
Surface FinishHASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.

Our Advantages:

  • Wide range of high frequency materials, Rogers, Taconic and Wangling etc;
  • More than 19+ years’ high frequency PCB experience;
  • Strict WIP inspection and monitoring as well as working instruction;
  • 16000㎡workshop;
  • 30000㎡output capability per month;
  • 8000 types of PCB's per month;
  • Small quantity order is available;
  • ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
  • IPC Class 2 / IPC Class 3;
  • Delivery on time: >98%, Customer complaint rate: <1%

Appendix: Typical Value of RO4534:

PropertyRO4534DirectionUnitsConditionTest Method
Dielectric Constant, er Process3.4 ± 0.08Z-10 GHz/23℃2.5 GHzIPC-TM-650,2.5.5.5
Dissipation Factor0.0022Z-2.5 GHz/23℃IPC-TM-650, 2.5.5.5
0.002710 GHz/23℃
PIM (Typical)-157dBc Reflected43 dBm swept tonesSummitek 1900b PIM Analyzer
Dielectric Strength>500ZV/mil0.51 mmIPC-TM-650, 2.5.6.2
Dimensional Stability<0.3X,Ymm/m (mils/inch)after etchIPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion11Xppm/℃-55 to 288℃IPC-TM-650, 2.4.41
14Y
46Z
Thermal Conductivity0.6W/(m.K)80℃ASTM C518
Moisture Absorption0.06%D48/50IPC-TM-650, 2.6.2.1 ASTM D570
Tg>280℃TMA AIPC-TM-650, 2.4.24.3
Density1.8gm/cm3ASTM D792
Copper Peel Strength6.3（1.1）lbs/in (N/mm)1 oz. EDC post solder floatIPC-TM-650, 2.4.8
FlammabilityNON FRUL 94
Lead-Free Process CompatibleYes
MANUFACTURING PROCESS:

Manufacturing Process of Dual Layer PTH PCB

BICHNEG PCB WORKSHOP:

BICHNEG PCB WORKSHOP

BICHNEG PCB CERTIFICATION:

BICHNEG PCB CERTIFICATION

BICHENG PCB MAIN COURIERS:

BICHENG PCB MAIN COURIERS

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