High Speed Long PCB for Smart Home

High Speed PCB

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Complex Integrated Systems

• Applications Enabled By CIS
  • Massive Wireless Broadband with 5G mmWave Systems
  • High-Performance Computing Applications in Edge Devices and Data Centers
  • AR/VR/MR Devices
  • Advanced Driver Assistance Systems for Passenger Vehicles
  • Integrated Photonics
• CIS Impacts on the Complete Product Lifecycle
  • Design for CIS
  • Smart Manufacturing for CIS
  • Testability/In-Field Reliability for CIS
  • Sustainability for CIS
• CIS Acronyms

Sustainable Electronics

• Circularity
• Materials
• Sustainable Electronics Acronyms
• Sustainability in Electronics Materials: Tables

mmWave Materials and Test

• Application Segments for mmWave Materials and Test
  • 5G and 6G Cellular Communications
    • Lower loss materials for improved system link budgets
  • Automotive Drivers Specific to mmWave Materials and Test
    • Low cost radar sensor solutions for autonomous driving
• Materials Development
  • Low cost and ease of manufacturability with new materials
  • Tailorable and stable relative permittivity εr or dielectric constant Dk
  • Low dielectric loss (tanδ)
  • Stable material properties with moisture absorption
• Low-Loss Dielectric Materials Characterization
  • Higher frequencies for 5G result in requirements for lower dimensional variation and measurement errors
  • Minimal variation between measured and operational characteristics
  • Lack of Standard Reference Material (SRM)
  • Accurately characterize anisotropic behavior
• Electrical Test
  • Over the Air (OTA) vs contact testing
  • Scaling up mmWave testing from lab environments to mass production environments

Printed Circuit Board (PCB)

• High Speed PCB
• High Speed Substrates
• Test, Inspection and Measurement
• Environmental
• Laminates
• Microwave RF and mmWave PCB
  • Skin Depth at mmWave Frequencies
• PCB Acronyms

Board Assembly

• Assembly Materials
  • Solder Pastes
  • Thermal Interface Materials
  • Conformal Coatings
  • Underfills
  • Encapsulant/Potting Materials
  • Wave Solder Materials
  • Rework Solder Materials
• Surface Mount Technology Printing and Reflow
  • SMT Printing
  • SMT Reflow
• Rework and Repair
  • Component-level
  • Board-level + Workforce Issues
• Press Fit
  • Press Fit: 2019 Roadmap
• Central Process Unit (CPU) Socket Interconnect
• Board Assembly Acronyms

Packaging & Heterogeneous Integration

Smart Manufacturing

• Application Domain Perspectives: Electronics Manufacturing
  • Responding to rapidly changing, complex business requirements
  • Supporting sustainability and safety in the manufacturing facility environment
  • Achieving financial growth targets while margins are declining
  • Meeting manufacturing facility and equipment reliability, capability, productivity, quality, and cost requirements
  • Leveraging manufacturing facility integration technologies across industry segment boundaries
  • Meeting the flexibility, extendibility, and scalability needs of a leading-edge manufacturing facility
• Security for Smart Manufacturing
• Data Flow Architecture
  • Robust and flexible connectivity architecture across electronics vertical segments to enable smart manufacturing functionality

Roadmap Drivers

• Application Drivers
  • Automotive
    • Improve efficiency of fossil-fuel power-trains
    • Transition from fossil fuel to electric vehicles
    • Improve vehicular safety
    • Enhance driver and passenger comfort and convenience
  • Computing and Communications
    • Cloud and Data Centers
      • Cloud & High-Performance Computing Application Requirements for Advanced Packaging
      • Reduce TCO with commodity hardware
      • Reduce energy costs and carbon footprint
      • Increase storage capacity
      • Efficiently support new application loads with hardware specialization
    • 5G and 6G Cellular
  • Consumer Electronics
    • Improve power efficiency
    • Reduce form factor (weight and volume)
  • IoT
    • Minimize cost of ownership with autonomous powering of IoT devices
  • Lighting
    • Minimise LED luminaire cost
    • Decrease luminaire power consumption
    • Long-life solutions for minimal maintenance and new fixture designs
    • Maintain backward compatability for retrofit residential and commerical installations
    • Improve lighting ambience
    • How to differentiate LED solutions with declining sale prices in the retrofit residential market?
    • Backward compatible T-lamp replacement
    • Reducing flicker and acoustic noise
  • Medical Devices
    • Advanced therapies require new and more extensive use of medical devices.
    • Decrease load on primary heathcare and hospital systems by supporting home healthcare solutions
    • Development of artificial intelligence, deep learning and machine learning for healthcare applications
    • 3D Medical Printing
    • Growing popularity in surgical robotics
  • Motor Control for HVAC and Residential Appliances
    • Improve power efficiency of motors by moving to variable speed solutions
    • Add low-cost digital control to create integrated motor drives
    • Reduced maintenance costs using remote real time diagnostics with IoT
    • Better extraction of instantaneous motor performance information to simplify sensing and improve reliability
  • Wireless Devices and Infrastructure
    • 5G and 6G Cellular Devices and Infrastructure
      • 5G wireless local