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High Speed Multilayer PCB for Communication Equipment

Multilayer PCBs - Electronic Components Marketing Group

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Multilayer PCBs

Electronic Components Marketing Group

Multilayer PCBs are made up of four or more conductive copper foil layers. This allows for a high level of circuit complexity and higher assembly density (thus saving space in your device).

Our Manufacturing partners at ECMG possess the capability to produce multilayer PCBs up to 68 layers. Multilayer PCBs are used in complex and high technology applications with even greater component densities than single and double sided PCBs. These are typically found in telecom, datacom, automotive, medical, instrumentation and controls, consumer electronics, health and fitness applications and many others.

Depending on your device’s needs, multilayer PCBs may be the right solution for you. Use the buttons below to request a quote or learn more about your PCB options.

Capabilities

Double-Sided & Multi-Layered
ItemsMassSample
Layers2-68LUp to 120L
Max. Board Thickness10mm(394mil)14mm(551mil)
Min. Width/Space Inner Layer50/50um40/40um
Outer Layer65/65um50/50um
Registration Same Core±25um±20um
Layer to Layer±4.5mil±4mil
Max. Copper Thickness6oz30oz
Min. Drill Hole Diameter Mechanical≥0.15mm(6mil)≥0.1mm(4mil)
Laser0.1-0.35mm0.05-0.35mm
Max. Size (Finish Size)Line-card850mmX570mm1000mmX570mm
Backplane1250mmX570mm1320mmX570mm
Aspect Ratio (Finish Hole)Line-card20:127:1
Backplane25:132:1
Material FR4EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF
High SpeedMegtron4, TU872SLK, FR408HR,N4000-13 Series, S7439C,TU863+, Megtron6, MW2000, IT968,EM891, Megtron7,MW4000,TU933,DS7409DVN,IT988GSE
High FrequencyRo3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY series,AD series,RT6002
OthersPolyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,ST115
Surface FinishHASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG 20
Double-Sided & Multi-Layered Roadmap
Products201920202021
Mass SampleMass SampleMass SampleMass Sample
Backplane Layers2-68L Up to 120L2-68L Up to 120L2-68L Up to 120L
Finish Size1250mmX570mm 1320mmX570mm1250mmX570mm 1320mmX570mm1250mmX570mm 1320mmX570mm
Board Thickness10mm 14mm10mm 14mm10mm 14mm
Aspect Ratio(0.31mmFinishHole25:1 32:125:1 35:130:1 35:1
Aspect Ratio(0.36Finish Hole)27:1 33:127:1 33:127:1 33:1
Line-card Layers32 3636 3636 36
Width/Space(Outer Layer)3mil/3mil 2.5mil/2.5mil3mil/3mil 2.5mil/2.5mil3mil/3mil 2.5mil/2.5mil
Width/Space(Inner Layer)2.2mil/2.2mil 2mil/2mil2.2mil/2.2mil 2mil/2mil2.2mil/2.2mil 2mil/2mil
Aspect Ratio(0.15mmFinish Hole20:1 25:122:1 25:122:1 25:1
Aspect Ratio(0.20mmFinish Hole)21:1 27:124:1 27:125:1 27:1
Impedance Tolerance±7%±5%±5%±5%±5%±5%
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Capabilities

click through any of the buttons below to see their full capabilities matrix

Double-Sided & Multi-Layered

Double-Sided & Multi-Layered Roadmap

Multilayer PCB Uses