Helen Frankenthaler PCB Circuit Board R&D Center

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Rigid PCBs | PCB Prime

long flexible pcb electronics factory

Rigid PCBs | PCB Prime

PCB Prime offers the highest quality rigid circuit boards at the most competitive pricing. Whether you need a few quick-turn PCB prototypes or mass production, our world-class PCB manufacturing and assembly can meet your specialized PCB needs.

Combining years of experience with the latest in high-tech manufacturing efficiencies allow our pricing to be among the most competitive. Our rigid circuit boards are manufactured based on IPC guidelines and comply with ISO 9001:2015, UL, and RoHS standards.

PCB Types
CAP or Foil ConstructionControlled Impedance
Blind / Buried ViaMixed Inner Copper Weights
FlexMixed Materials
Rigid-Flex(HDI) High-Density Interconnect
Aluminum Core (single-sided to multi-layer)Via-In-Pad Process

Printed Circuit Board Capabilities and Tolerances

Below are the rigid circuit board capabilities and tolerances that we can currently manufacture.

We are working to expand our rigid PCB offerings so please revisit this page frequently for updates.

We offer very high-end features and capabilities at competitive pricing:

  • Rigid PCBs up to 42 layers
  • 3-mil traces and 3.5-mil spaces
  • Minimum Mechanical drill size 8-mil
  • Minimum Laser drill size 3-mil
  • ISO 9001 and UL certified
  • Controlled Impedance
  • Blind / Buried Vias
  • Class III
  • RoHS Compliant (all options available)
  • High temperature, high-frequency material
  • Aluminum and other special material
ItemEnglishMetric
LAMINATE
Max Board Thickness314.96 mil8.000 mm
Min Board Thickness (2 Layers)10 mil0.254 mm
Min Board Thickness (4 Layers)11.8 mil0.300 mm
Min Core Thickness (Not including copper)2 mil0.051 mm
Largest Panel Size23.62" x 39.37"599.95 mm x 1000 mm
Min Pre-Preg Thickness2.3 mil0.058 mm
Board Thickness Tolerance (Standard)±10% or ±5 mil, whichever is greater
Board Thickness Tolerance (Upon Request)±5%
COPPER
Max Inner Layer Copper Thickness6 oz.0.20 mm
Min Inner Layer Copper Thickness0.3 oz.0.01 mm
Max Outer Layer Copper Thickness11 oz.0.383 mm
Min Outer Layer Copper Thickness (no plating in holes)0.25 oz.0.009 mm
DRILL
Min Drill Size6 mil0.15 mm
Min Laser Drill Size3 mil0.076 mm
Min Mechanical Aspect Ratio (Laminate / Drill)12 / 1
TRACES / SPACES
Min Line Width / Spacing (Outer Layer)3 / 3.5 mil0.076 mm / 0.089 mm
Min Line Width / Spacing (Inner Layer)3 / 3.5 mil0.076 mm / 0.089 mm
Min Copper Space to outline CNC Route/Score10/12 mil0.25 mm / 0.3 mm
SOLDER MASK COLORSSILK SCREEN COLORS
Green, Matte Green, Light Green, Black, Matte Black, White, Yellow, Red, Blue, ClearWhite, Black, Yellow, Red, Blue, Green
SOLDER MASK
Min Solder Mask Print Width (Mask Dam)4 mil0.102 mm
Solder Mask Registration Tolerance±2 mil0.051 mm
CONTROLLED IMPEDANCE
Controlled Impedance (Standard)±10%
Controlled Impedance (Upon Request)±7%
SURFACE FINISHES
Lead Solder (HASL)OSP (Entek)
Lead Free Solder (HASL)Deep/Hard/Flash Gold (Electrolytic Nickel Gold)
Immersion Gold (Electroless Nickel Gold - ENIG)Wirebondable Gold (99.99% Pure Gold)
Immersion SilverCarbon Ink
Immersion Tin (White Tin)Gold Finger (Hard Gold)
MATERIALS
FR4 (135°C Tg)Flex
FR4 (170°C -180°C Tg)Rigid-Flex
Aluminum