This white paper is designed to guide you through the intricacies of rigid-flex printed circuit board (PCB) design. In today’s electronics industry, there has never been more demand for compact, efficient, and versatile PCBs. Rigid-flex technology has emerged as a game-changer, offering engineers the flexibility to design boards that can bend and flex without sacrificing performance or reliability.
How to work with bendable boards without sacrificing performance or reliability.
To read more, click here.
There are numerous ways to remove heat from chips, and more are on the way.
A chiplet marketplace would require deep changes in the design-through-manufacturing flow.
As data center infrastructures adapt to evolving workloads, parts of Ethernet can be found in scale-up approaches.
Artificial intelligence has become central to almost all advances happening within semiconductors and EDA, but will that continue throughout the year?
Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures.
Concern is growing in complex designs where there are few dedicated tools to help find and deal with it.
Inconsistent demand from multiple features can greatly increase the number of corner cases.
Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.
2.5D, 5G, advanced packaging, AI, AMD, ANSYS, Apple, Applied Materials, ARM, Arteris, automotive, business, Cadence, chiplets, EDA, eSilicon
