High TG High Frequency PCB for Motor Control

Rogers RT/duroid 6035HTC High Frequency PCB Supplier | Bicheng PCB

Rogers RT/duroid 6035HTC High Frequency PCB 2-Layer 20mil 0.508mm Thickness Shipped: 27th-Nov-2023 We are delighted to share one of our newest arrival of RT/duroid 6035HTC PCBs, a revolutionary solution that takes high-power RF and microwave applications to new heights of performance and reliability.

Introducing RT/duroid 6035HTC:

Experience the exceptional capabilities of Rogers RT/duroid 6035HTC high-frequency circuit materials, specially designed for high-power RF and microwave applications. These ceramic filled PTFE composites offer outstanding performance and reliability in demanding high-power environments. With a thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, and copper foil (ED and reverse treat) providing excellent long-term thermal stability, RT/duroid 6035HTC laminates are the ideal choice for high-power applications. Moreover, Rogers' advanced filler system ensures excellent drill-ability, reducing drilling costs compared to other high thermally conductive laminates that use alumina fillers.

Key Features:

• Dielectric constant (DK) of 3.5 +/- 0.05 at 10 GHz/23°C.
• Dissipation factor of 0.0013 at 10 GHz/23°C.
• Thermal coefficient of dielectric constant (TCDk) of -66 ppm/°C.
• Moisture absorption of 0.06%.
• Thermal conductivity of 1.44 W/m/K at 80°C.
• Coefficient of thermal expansion (CTE) in X-axis of 19 ppm/°C, Y-axis of 19 ppm/°C, and Z-axis of 39 ppm/°C.

Key Benefits:

• High thermal conductivity enables efficient heat dissipation, resulting in lower operating temperatures for high-power applications.
• Low loss tangent ensures excellent high-frequency performance.
• Thermally stable low-profile and reverse treat copper foil contribute to lower insertion loss and excellent thermal stability of traces.
• The advanced filler system improves drill-ability and extends tool life compared to circuit materials containing alumina.

PCB Stackup: 2-layer rigid PCB

• Copper Layer 1: 35 μm
• RT/duroid 6035HTC: 0.508 mm (20 mil)
• Copper Layer 2: 35 μm

PCB Construction Details:

• Board Dimensions: 200.5 mm x 41.5 mm (1PCS) with a tolerance of +/- 0.15 mm
• Minimum Trace/Space: 4/6 mils
• Minimum Hole Size: 0.3 mm
• No blind vias are used in this design.
• Finished Board Thickness: 0.6 mm
• Finished Copper Weight: 1 oz (1.4 mils) on the outer layers
• Via Plating Thickness: 20 μm
• Surface Finish: Bare Copper, no additional surface finishes
• Top Silkscreen: No
• Bottom Silkscreen: No
• Top Solder Mask: No
• Bottom Solder Mask: No
• Each PCB undergoes a 100% electrical test prior to shipment.

PCB Statistics:

• Components: 26
• Total Pads: 100
• Thru Hole Pads: 58
• Top SMT Pads: 42
• Bottom SMT Pads: 0
• Vias: 47
• Nets: 5
• Artwork Supplied: Gerber RS-274-X
• Accepted Standard: IPC-Class-2
• Availability: These PCBs are available worldwide, ensuring accessibility for customers globally.

Typical Applications:

• High-power RF and microwave amplifiers
• Power amplifiers, couplers, filters, combiners, power dividers

Appendix: RT/duroid 6035HTC Data Sheet

RT/duroid 6035HTC Typical Value

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