High TG High Frequency PCB for Power Supply

20mil RT/Duroid 6035HTC High Frequency Rogers PCB Board For Power Amplifiers

20mil RT/Duroid 6035HTC High Frequency Rogers PCB Board For Power Amplifiers

MOQ:1PCS

Standard Packaging:Vacuum bags+Cartons

Delivery Period:8-9 working days

Payment Method:T/T

Supply Capacity:5000PCS per month

Detail Information

Property	Details
Place of Origin	CHINA
Brand Name	Bicheng
Certification	UL, ISO9001, IATF16949
Model Number	BIC-126.V1.0
Base Material	Ceramic-filled PTFE Composites
Layer Count	Double Layer, Multilayer, Hybrid PCB
PCB Thickness	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB Size	≤400mm X 500mm
Solder Mask	Green, Black, Blue, Yellow, Red Etc.
Copper Weight	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish	Bare Copper, HASL, ENIG, OSP Etc..
Highlight	High Frequency Rogers PCB Board, 20mil Rogers PCB Board, 6035HTC Rogers PCB Board

Product Description

Double Sided Rogers High Frequency PCB Built On 20mil RT/duroid 6035HTC with Immersion Gold for Power Amplifiers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

Features/Benefits:

High Thermal conductivity Improved dielectric heat dissipation enables lower operating temperatures for high power applications
Low loss tangent Excellent high frequency performance
Thermally stable low profile and reverse treat copper foil Lower insertion loss and excellent thermal stability of traces
Advanced filler system Improved drill ability and extended tool life compared to alumina containing circuit materials

Data Sheet of RT/duroid 6035 HTC

Property	RT/duorid 6035HTC	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.50±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.6	Z		8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor	0.0013	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-66	Z	ppm/℃	-50 ℃to 150℃	mod IPC-TM-650, 2.5.5.5
Volume Resistivity	108	MΩ.cm	A		IPC-TM-650, 2.5.17.1
Surface Resistivity	108	MΩ	A		IPC-TM-650, 2.5.17.1
Dimensional Stability	-0.11 -0.08	CMD MD	mm/m (mils/inch)	0.030" 1oz EDC foil Thickness after etch '+E4/105	IPC-TM-650 2.4.39A
Tensile Modulus	329 244	MD CMD	kpsi	40 hrs @23℃/50RH	ASTM D638
Moisure Absorption	0.06%		D24/23		IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)	19 19 39	X Y Z	ppm/℃	23℃ / 50% RH	IPC-TM-650 2.4.41
Thermal Conductivity	1.44		W/m/k	80℃	ASTM C518
Density	2.2		gm/cm 3	23℃	ASTM D792
Copper Peel Stength	7.9		pli	20 sec. @288 ℃	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-Free Process Compatible	Yes

Some Typical Applications:

High Power RF and Microwave Amplifiers
Power Amplifiers, Couplers, Filters
Combiners, Power Dividers

PCB Capability (RT/duroid 6035 HTC)

PCB Material:Ceramic-filled PTFE composites
Designation:RT/duroid 6035HTC
Dielectric constant:3.50±0.05
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..