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Designing High Voltage PCBs: Key Layout and Material Considerations

High‑Voltage PCB Design Guidelines | PICA Manufacturing

4 Ash Street Extension, Derry, NH 03038

1.855.742.2634

pcb@frankenthalerfoundation.org

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Products / Technologies Close Products / Technologies Open Products / Technologies

• Flexible Circuit Boards / Flex PCB
• Rigid Flex Circuit Boards / Rigid Flex PCB
• Printed Circuit Boards (PCBs)
• Metal Core Printed Circuit Boards
• Flat Flexible Cables
• Ceramic Printed Circuit Boards
• FPCBA & PCBA Assembly
• Wire Harnesses
• Hybrid Technologies (Combining Technologies)
• Membrane Switches
• Injection Molding
• Overmolding
• Precision Machining
• Box Build Assembly & Turnkey Solutions

Expertise Close Expertise Open Expertise

• Dynamic Flex
• Extra-long Flex Printed Circuits (FPC)
• Ultra-Thin Flexible Printed Circuits
• R2R (Roll to Roll Processing)
• Fineline PCB (High Density Interconnect)
• Blind and Buried Microvias
• Integrate Circuit Substrate Carrier
• Thermal Management
• EMI (Electromagnetic Interference) Shielding
• Heavy Copper
• Impedance Control
• X-Ray Inspection (On-Site Service)

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• Medical
• Wearables
• Payment & Identity
• Communication
• Automotive
• Defense and Security
• Industrial
• Biosensors

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Education

Explore our Education section for valuable insights, resources, and expert guidance on manufacturing solutions. Stay informed with industry trends, best practices, and innovations to optimize your operations and success.

Blog

• Understanding Flexible Printed Circuit (FPC) Cost Drivers
• Malaysia: A Thriving Hub for Electronic Manufacturing
• Optimizing Wire Harness Design for Resilience in Harsh Environments
• Alternatives to Copper in Flexible Circuits
• Auxiliary Materials in Flex PCB Builds
• Flex PCB Adhesives and Bonding Guide

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• Research and Academia
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• PICA Company Overview Booklet
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• Credentials
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• Bilingual Technical Glossary
• PICA’s FAQ
• PICAKit

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Our Mission

The PICA team is laser focused on helping you bring your ideas from design to delivery with engineer-driven solutions, impeccable service, and a dependable supply chain network.

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Contact

1.855.742.2634

Request a Quote

• About Us
  • Our Story
  • Locations
  • Careers
• Products/Technologies
  • Core
    • Flexible Circuit Boards / Flex PCB
    • Rigid Flex Circuit Boards / Rigid Flex PCB
    • Printed Circuit Boards (PCBs)
    • Metal Core Printed Circuit Boards
    • Flat Flexible Cables
  • Secondary
    • FPCBA & PCBA Assembly
    • Wire Harnesses
    • Hybrid Technologies (Combining Technologies)
    • Membrane Switches
  • Third
    • Ceramic Printed Circuit Boards (PCB)
    • Injection Molding
    • Overmolding
    • Precision Machining
    • Box Build Assembly & Turnkey Solutions
• Expertise
  • Col One
    • Dynamic Flex
    • Extra-long Flex Printed Circuits (FPC)
    • Ultra-Thin Flexible Printed Circuits
    • R2R (Reel to Reel Processing)
  • Col Two
    • Fineline PCB (High Density Interconnect)
    • Blind and Buried Microvias
    • Integrate Circuit Substrate Carrier
    • Thermal Management
  • Col Three
    • EMI Shielding
    • Heavy Copper
    • Impedance Control
    • X-Ray Inspection On-Site Service
• Markets
  • Medical Market
  • Wearables Market
  • Payment & Identity Market
  • Communications Market
  • Automotive Market
  • Defense & Security Market
  • Industrial Electronics Market
  • Biosensor Market
• Education
  • Blogs
  • Case Studies
  • White Papers
  • Videos
  • eBooks
• Resources
  • PICA Company Overview Booklet
  • Capabilities
  • Trade Shows and Events
  • Credentials
  • Glossary
  • PICA’s FAQ
  • PICAKit
• Contact
• English
• About Us
  • Our Story
  • Locations
  • Careers
• Products/Technologies
  • Core
    • Flexible Circuit Boards / Flex PCB
    • Rigid Flex Circuit Boards / Rigid Flex PCB
    • Printed Circuit Boards (PCBs)
    • Metal Core Printed Circuit Boards
    • Flat Flexible Cables
  • Secondary
    • FPCBA & PCBA Assembly
    • Wire Harnesses
    • Hybrid Technologies (Combining Technologies)
    • Membrane Switches
  • Third
    • Ceramic Printed Circuit Boards (PCB)
    • Injection Molding
    • Overmolding
    • Precision Machining
    • Box Build Assembly & Turnkey Solutions
• Expertise
  • Col One
    • Dynamic Flex
    • Extra-long Flex Printed Circuits (FPC)
    • Ultra-Thin Flexible Printed Circuits
    • R2R (Reel to Reel Processing)
  • Col Two
    • Fineline PCB (High Density Interconnect)
    • Blind and Buried Microvias
    • Integrate Circuit Substrate Carrier
    • Thermal Management
  • Col Three
    • EMI