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IS550H Very High Thermally Reliability Laminate and Prepreg | Isola Group

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Thermal Performance

Tg: 200°C

Td: 400°C

Electrical Performance

Dk: 4.43

Df: 0.016

Industry Approvals

IPC-4101 /140

UL - File Number E41625

IS550H was developed in conjunction with a consortium of industry experts for high power & high voltage applications and PEV & HEV automotive electrification. The resulting solution addresses critical application needs for use in a harsh environment where very demanding, long term thermal reliability performance, extreme thermal cycling and very high voltage CAF & electro-migration resistance is required.

Markets

Product Summary

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Low moisture absorption
    • Lead-free assembly compatible
    • Halogen free
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 59 mil (0.05 to 1.5 mm)
  • Copper Foil Type
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Heavier copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Typical Values

PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC200°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss400°C2.4.24.6
Time to Delaminate by TMA (Copper removed)A. T260 B. T288>60Minutes
Z-Axis CTEA. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)38 210 2.2ppm/°C ppm/°C %
X/Y-Axis CTEPre-Tg13-17ppm/°C
Thermal Conductivity0.7W/m·KASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)A. Unetched B. EtchedPassPass Visual
Dk, PermittivityA. @ 2 GHz B. @ 5 GHz C. @ 10 GHz4.50 4.43 4.43—
Df, Loss TangentA. @ 2 GHz B. @ 5 GHz C. @ 10 GHz0.014 0.014 0.016—
Volume ResistivityA. C-96/35/90 B. At elevated temperature5.2 x 10 7 3.2 x 10 8MΩ-cm
Surface ResistivityA. C-96/35/90 B. At elevated temperature1.0 x 10 8 3.9 x 10 8MΩ
Dielectric Breakdown60kV2.5.6B
Arc Resistance>160Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)46.9(1190)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3Class (Volts)UL 746A ASTM D3638
Peel StrengthA. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF)1.45 (8.2) 1.35(7.6)N/mm (lb/inch)
Flexural StrengthA. Length direction B. Cross direction420 (60.9) 350 (50.8)MPa (kpsi)
Tensile StrengthA. Length direction B. Cross direction214 (31) 186 (27)MPa (kpsi)
Young's ModulusA. Length direction B. Cross direction28730 (4167) 24841 (3603)MPa (ksi)
Poisson's RatioA. Length direction B. Cross direction0.174 0.151—
Moisture Absorption0.25%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)150°CUL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Constructions

Core Data
ConstructionsResin Content %Standard/ AlternateThickness (inch)Thickness (mm)Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
1x103566.0%Standard0.00200.054.32 0.0120
1x108062.0%Standard0.00300.084.40 0.0120
1x331357.0%Standard0.00400.104.51 0.0120
2x103566.0%Standard0.00400.104.32 0.0120
1x331360.0%Standard0.00450.114.44 0.0120
1x211655.0%Standard0.00500.134.56 0.0120
2x108062.0%Standard0.00600.154.40 0.0120
1x762844.0%Standard0.00740.194.83 0.0110
1x762847.0%Standard0.00800.204.75 0.0110
2x331357.0%Standard0.00800.204.51 0.0120
2x211655.0%Standard0.01000.254.56 0.0120
2x762844.0%Standard0.01480.374.83 0.0110
2x762847.0%Standard0.01600.414.75 0.0110
3x762844.0%Standard0.02200.564.83 0.0110
4x762844.0%Standard0.03000.764.83 0.0110
5x762847.0%Standard0.03900.994.75 0.0110
6x762847.0%Standard0.04801.194.75 0.0110
8x762844.0%Standard0.05901.504.83 0.0110
Prepreg Data
Glass StyleResin Content %Standard/ AlternateThickness (inch)Thickness (mm)Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
103566.0%Standard0.00200.0514.32 0.0120
10676.0%Standard0.00240.0614.12 0.0130
103575.0%Standard0.00280.0714.14 0.0130
108068.0%Standard0.00330.0844.28 0.0130
108072.0%Standard0.00390.0994.20 0.0130
331360.0%Standard0.00450.1144.44 0.0120
108077.0%Alternate0.00490.1244.10 0.0130
211655.0%Standard0.00500.1274.56 0.0120
211658.0%Standard0.00540.1374.49 0.0120
211662.0%Alternate0.00610.1554.40 0.0120
762847.0%Standard0.00790.2014.75 0.0110
762852.0%Standard0.00900.2294.63 0.0110

NOTE

Revisions:

A-Original-1/2021

B-Added 2x106 4 mil & 1x2116 4.5 mil cores and 106 80% RC prepreg - 8/21

C-Changed construction of 2 mil 1x106 to 1x1035 core, changed 4 mil 2x106 to 2x1035 core, changed 4.5 mil 1x2116 to 1x3313 core, added 7.4 mil 1x7628 and 14.8 mil 2x7828 core, removed 47 mil 6x7628 and 63 mil 8x7628 core. Removed 106 70% and 80% prepreg, added 1035 66%, 3313 60% and 2116 62%. Changed 1080 77% to alternate. - 6/23

Documentation

Resource Title & SummaryDate Updated
IS550H Laminate Supplemental10/31/2025
IS550H Prepreg Supplemental10/31/2025
IS550H Prep