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The Zeta-20 benchtop optical profiler is a non-contact, 3D microscope and surface topography measurement system. The 3D optical profiling system is powered by patented ZDot technology and Multi-Mode optics, enabling measurement of a variety of samples: transparent and opaque, low to high reflectance, smooth to rough texture, and step heights from nanometers to millimeters.
The Zeta-20 3D optical profiling system integrates six different optical metrology technologies in one configurable and easy-to-use system. ZDot measurement mode simultaneously collects a high-resolution 3D scan and a True Color infinite focus image. Other 3D measurement techniques include white light interferometry, phase shifting interferometry, Nomarski interference contrast microscopy, and shearing interferometry. Film thickness can be measured with ZDot or an integrated broadband reflectometer. The Zeta-20 is also a high-end microscope that can be used for sample review or automated defect inspection. The Zeta-20 3D optical profiling microscope supports both R&D and production environments by providing comprehensive step height, roughness, and film thickness measurements, and defect inspection capability.
The Zeta-20 3d optical profiler microscope is capable of measuring 3D, non-contact step heights from nanometers to millimeters. ZDot and Multi-Mode optics provide a range of methods to measure the step height. ZDot is the primary measurement technique and can quickly measure steps from tens of nanometers to millimeters. ZI interferometry can be used to measure steps from nanometers to millimeters over a large area. ZSI shearing interferometry can be used to measure steps less than 80nm.
The Zeta-20 optical profiler is capable of measuring film thickness of transparent film(s) using ZDot or ZFT measurement techniques. ZDot is used to measure transparent films greater than 10µm, such as photoresist or microfluidic device layers that are coated on higher refractive index substrates. ZFT uses an integrated broadband reflectometer to measure films from 30nm to 100µm. This can be done for a single or multiple-layer film stack, with the user entering the properties of the film or using a model to fit the spectrum.
The Zeta-20 3D optical microscope measures 3D texture, quantifying the sample’s roughness and waviness. ZDot enables measurement of roughness ranging from tens of nanometers to very rough surfaces. ZSI and interferometry enable measurement of smooth surfaces, from angstroms to microns. Software filters separate the measurements into roughness and waviness components and calculate parameters, such as root mean square (RMS) roughness. Nomarski interference contrast microscopy enables visualizing very fine surface detail by revealing small changes in the slope.
The Zeta-20 surface microscope can measure the 2D and 3D shape or bow of a surface. This includes measurement of wafer bow that can result from mismatch between layers during the production of semiconductor or compound semiconductor devices. The Zeta-20 can also quantify the 3D height and radius of curvature of structures, such as a lens.
The Zeta-20 is capable of measuring stress induced during the manufacture of devices with multiple layers, such as semiconductor or compound semiconductor devices. The bow of the surface is accurately measured using a stress chuck to support the sample in a neutral position. The change in shape from a process, such as film deposition, is then used to calculate the stress, applying the principles of Stoney’s equation. The Zeta-20 measures 2D stress by finding the height of the sample surface at user-defined intervals across the full sample diameter and then combining the data into a profile of the sample shape.
The Zeta-20 optical microscope is capable of Automated Optical Inspection (AOI) to rapidly inspect the sample, differentiate different defect types, and map defect density across the sample. When combined with the 3D metrology capability, the Zeta-20 can provide additional information about the defect that cannot be obtained with 2D inspection systems, enabling quicker identification of the defect source.
Zeta-20 defect review uses an inspection tool KLARF file to drive the stage to the defect locations. The user can inspect the defect with the high-quality microscope or measure the topography of the defect, such as the height, thickness, or texture. This provides additional detail about the defect that cannot be obtained from a 2D defect inspection system. The Zeta-20 can also mark defects with a scribe, making it easier to find the defect on tools, such as SEM review tools, that have a limited field of view.
The Zeta-20 optical profiler is well-suited for solar cell applications by supporting measurement of surfaces that combine very low and very high reflectance materials. The system can quantify the post-etch texture – pyramid structures that reflect less than 1% of the incident light and are critical to the light capture ability of the solar cell. Adjacent to the texture are silver paste contact lines that have a reflectance greater than 90%. The Zeta-20 with ZDot and a high measurement dynamic range can simultaneously measure the very low and very high reflectance regions, quantifying the silver paste line height, width, and volume of silver deposited that determines electrical line resistance. In addition, the Zeta-20 is used for measurement of the incoming wafer roughness, nitride film thickness using ZFT, isolation trench depth, sample bow, stress, and 3D defects.
The Zeta-20 optical profiling system supports wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP) metrology requirements. A key enabling technology of the optical profiling microscope is the capability to measure the height of the plated copper with the dry photoresist film intact. This is accomplished by measuring through the transparent photoresist to the seed layer to measure the height of the copper pillar, thickness of the photoresist, and relative height difference of copper and photoresist. Additional applications include measurement of redistribution lines (RDL), under bump metallization (UBM) height and texture, photoresist opening critical dimension (CD), photoresist thickness, and polyimide thickness. Coplanarity of the metal contacts can also be measured to determine if the bump height meets final device packaging connectivity requirements.
The Zeta-20’s high dynamic range enables surface roughness and step height measurements from nanometers to millimeters without a configuration change. It can handle high-reflectance films (e.g., copper) as well as transparent films that are commonly found on PCBs. The Zeta-20 supports critical dimension measurements (height and width) for blind via holes, line traces and hot bars, plus surface roughness.
The Zeta-20 can measure topography changes induced by laser surface processing for semiconductors, LED, microfluidic devices, PCBs, and more. Lasers have been adopted for precision micro-scale machining and surface conditioning in industries, such as semiconductors, LED, and biomedical devices. For the semiconductor industry, measurement of the height and width of a wafer ID mark is critical to ensuring it can be read successfully throughout numerous processing steps. The Zeta-20 can measure the step height of high aspect ratio via holes created on flexible circuits and wafers. It can also measure the depth and width of the solar cell isolation trench that improves device efficiency.
The Zeta-20 has the capability to measure microfluidic devices fabricated in materials, such as silicon, glass, and polymers. The system quantifies the height, width, edge profile, and texture of channels, wells, and control structures. The Zeta-20 can also measure the final device after it is sealed with a transparent top cover plate – compensating for the change in refractive index and quantifying changes from the stress of applying the cover plate.
The Zeta-20 is well-suited for biotechnology applications, offering non-contact measurement of a variety of sample surfaces having features from nanometers to millimeters. The Zeta-20 can measure high aspect ratio steps, such as the depth of deep wells for biotech devices. Micro-needle array structures for drug delivery can be measured taking advantage of the high numerical aperture objective lens and the ability to resolve a very low reflectance sample.
The options for the Zeta™-20 Optical Profiler are available to add on with your new product, or in the future. Contact your sales rep to learn more.
The Zeta-20HR high resolution configuration extends the capabilities of the Zeta-20 optical profilometer with an enhanced design optimized for solar cell metrology applications, including a 230mm x 230mm stage and advanced solar texture analysis.
The Zeta-20 offers an integrated broadband spectrometer for transparent thin film thickness measurements from 30nm to 100µm. It is capable of measuring single layer or multi-layer stack film thickness with the user selecting the refractive index
