Isola Carbon Ink PCB for Energy Storage

Advanced Ceramic PCB for High-Power & RF

What’s in Ceramic PCB?

Ceramic PCB is a printed circuit board that uses ceramic materials (e.g., alumina, aluminum nitride, beryllium oxide) as the substrate instead of traditional fiberglass (FR-4)

Ceramic PCB’s Key Features

Key Features	Description
High Thermal Conductivity	The thermal conductivity is 10-200 times that of FR-4 (aluminum nitride: 170-230 W/mK), allowing for rapid heat dissipation.
Low CTE (Coefficient of Thermal Expansion)	Match with chip materials (such as silicon) to reduce the risk of thermal stress cracking.
High-Temperature Resistance	The working temperature can reach above 350 ° C (FR-4 limit is about 130 ° C).
Excellent Electrical Insulation	High breakdown voltage, suitable for high-voltage scenarios.
Chemical Stability	Corrosion and oxidation resistance, suitable for harsh environments.

What’s the Difference Between Ceramic PCB & FR4?

Items	Ceramic PCB	FR-4 PCB
Thermal Conductivity (W/mK)	20~230 (aluminum nitride is the highest)	0.3~0.6
Dielectric Constant/Dk	9~10 (low high-frequency signal loss)	4.5~4.8 (higher frequency loss)
Cost	high cost due to complex materials and processes	lower cost
Application Scenarios	High power, high frequency, extreme environment	consumer electronics, regular circuits

Ceramic PCBs are widely used in applications requiring exceptional thermal management, high-frequency performance, and reliability. It common used in high-power electronics, RF(radio frequency) /microwave circuits, aerospace, automotive radar systems and medical devices, among other applications.

Power Electronics: IGBT module, electric vehicle inverter heat dissipation substrate.
RF/Microwave: 5G base station power amplifier (PA), radar T/R module.
Automotive: Autonomous driving LiDAR (Light Detection and Ranging)
Aerospace: Engine sensors, satellite power control system.
Medical Devices: Thermal management of laser medical probes.
LED Lighting: COB LED chip packaging solves the problem of light decay.

Manufacturing Process

Thick-Film Technology Screen printing metal paste (gold/silver/copper) on ceramic substrates and high-temperature sintering to form circuits.

Thin-Film Technology Vacuum sputtering coating+photolithography, with an accuracy of micrometer level, used for high-frequency chips.

DPC (Direct Plated Copper)The ceramic surface is directly copper plated, with strong adhesion, suitable for high-power LEDs.

HTCC/LTCC HTCC: 1600 ° C sintered alumina for aerospace/military applications. LTCC: 850 ° C sintered glass ceramic with integrated passive components.