High Density Interconnect (HDI) attributes are printed circuit board designs that employ increased feature density to achieve lighter weight, reduced layer count, and thinner stack ups.
HDI design configurations allow multi-track routing of high I/O, fine pitch devices 0.5 mm and below. Isola is an industry leader in resin system development and has designed several resin systems and construction sets that enable consistent, reliable production of HDI printed circuit board products. Our high performance products, such as 370HR, provide the thermally robust performance required for sequential lamination cycles of these complex structures. In addition, we utilize spread glass technology and incorporate square weave constructions whenever possible. These advanced glass technologies improve laser ablation consistency, critical feature registration, and dielectric thickness control. We offer our ultrathin glass fabrics for many of our high performance products.
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