Helen Frankenthaler PCB Circuit Board R&D Center

Isola High Power PCB for Medical Electronics

Isola Showcasing its Halogen-Free Low-Loss RF/Microwave PCB Materials at DesignCon 2023

Isola Showcasing its Halogen-Free Low-Loss RF/Microwave PCB Materials at DesignCon 2023

Isola Group, a leading global materials science company that specializes in the design and manufacture of copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards, will be showcasing its latest halogen-free, low-loss RF/microwave materials at DesignCon 2023 in Santa Clara, California.

Key Materials on Display

The company will highlight several advanced materials engineered for high-frequency applications. These materials are designed to meet the stringent performance and reliability requirements of modern RF and microwave systems.

Featured Products
  • Astra® MT77: A high-performance, low-loss laminate and prepreg system.
  • I-Tera® MT40: A low-loss, high-reliability material for demanding applications.
  • IS680-350: A halogen-free laminate designed for RF and microwave circuits.

Material Properties and Benefits

The showcased materials offer a combination of excellent electrical properties, thermal reliability, and environmental sustainability due to their halogen-free formulation.

MaterialKey PropertyPrimary Benefit
Astra MT77Ultra-low loss (Df)Enhanced signal integrity for high-speed designs
I-Tera MT40Stable dielectric constant (Dk)Consistent electrical performance over frequency and temperature
IS680-350Halogen-free compositionImproved environmental and safety profile

Target Applications

These materials are critical for next-generation electronic systems across multiple industries.

Primary Use Cases
  • 5G telecommunications infrastructure
  • Advanced radar and aerospace systems
  • High-performance computing and networking
  • Automotive radar and sensor systems
Industry Impact

The development of these advanced PCB materials supports the ongoing evolution of wireless technology, enabling faster data rates, improved efficiency, and more reliable connectivity in critical applications.