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Isola Long PCB for Smart Home

IS420 High Performance Laminate and Prepreg | Isola Group

long pcb assembly pcb macro

Thermal Performance

Tg: 170°C

Td: 350°C

Electrical Performance

Dk: 4.04

Df: 0.021

Industry Approvals

IPC-4101 /98 /99 /101 /126

UL - File Number E41625

IS420 laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric.This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability.

In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The IS420 system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimagable solder mask imaging.

Attributes

Product Summary

Product Features
  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence
Production & Manufacturing

Currently manufactured in Asia, Europe

Product Availability
  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
  • Copper Foil Type
    • HTE Grade 3
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Typical Values

PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC170°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss350°C2.4.24.6
Time to Delaminate by TMA (Copper removed)A. T260 B. T28860 >15Minutes2.4.24.1
Z-Axis CTEA. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)45 230 2.8ppm/°C ppm/°C %2.4.24C
X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
Thermal Conductivity0.4W/m·KASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)A. Unetched B. EtchedPassPass Visual2.4.13.1
Dk, PermittivityA. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz4.24 4.17 4.04 3.92 3.92—2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Df, Loss TangentA. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz0.0150 0.0161 0.0210 0.0250 0.0250—2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Volume ResistivityA. After moisture resistance B. At elevated temperature3.0 x 10 8 7.0 x 10 8MΩ-cm2.5.17.1
Surface ResistivityA. C-96/35/90 B. After moisture resistance C. At elevated temperature— 3.0 x 10 6 2.0 x 10 8MΩ2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance115Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A ASTM D3638
Peel StrengthA. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions1.14 (6.5) 1.25 (7.0) 1.25 (7.0) 1.14 (6.5)N/mm (lb/inch)2.4.8C 2.4.8.2A 2.4.8.3 2.4.8.3
Flexural StrengthA. Length direction B. Cross direction570 (82.7) 420 (60.9)MPa (kpsi) ksi2.4.4B
Moisture Absorption0.15%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
NOTE

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Revisions:
  • A: Initial release - 4/17
  • B: Corrected units for Flexural and Tensile Strength - 8/18
  • C: Change MOT to RTI 5/19
  • D: Added /126 slash sheet 02/20

Constructions

Core Data
ConstructionsResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz1 GHz2 GHz10 GHz
1x10672%0.0020.0504.30 0.1800 | 4.10 0.1800 | 3.95 0.0210 | 3.90 0.0240
1x108064%0.0030.0754.65 0.0180 | 4.26 0.0180 | 4.15 0.0210 | 4.10 0.0230
1x211647%0.0040.1004.60 0.0160 | 4.52 0.0160 | 4.35 0.0170 | 4.25 0.0170
1x211655%0.0050.1254.75 0.0160 | 4.37 0.0160 | 4.25 0.0170 | 4.20 0.0170
1x165252%0.0060.1504.75 0.0170 | 4.40 0.0170 | 4.25 0.0180 | 4.20 0.0190
1x762843%0.0070.1754.90 0.0160 | 4.58 0.0160 | 4.45 0.0170 | 4.35 0.0170
1x762848%0.0080.2004.85 0.0160 | 4.50 0.0160 | 4.40 0.0170 | 4.35 0.0180
2x211655%0.0100.2504.75 0.0160 | 4.37 0.0160 | 4.25 0.0170 | 4.20 0.0170
2x165252%0.0120.3004.75 0.0170 | 4.40 0.0170 | 4.25 0.0180 | 4.20 0.0190
2x762844%0.0140.3604.90 0.0160 | 4.57 0.0160 | 4.45 0.0170 | 4.40 0.0170
2x762848%0.0160.4104.85 0.0160 | 4.50 0.0160 | 4.40 0.0170 | 4.35 0.0180
3x165252%0.0180.4604.75 0.0170 | 4.40 0.0170 | 4.25 0.0180 | 4.20 0.0190
3x762842%0.0200.5104.91 0.0160 | 4.60 0.0160 | 4.45 0.0170 | 4.35 0.0170
3x762844%0.0210.5404.90 0.0160 | 4.57 0.0160 | 4.45 0.0170 | 4.40 0.0170
3x762848%0.0240.6104.85 0.0160 | 4.50 0.0160 | 4.40 0.0170 | 4.35 0.0180
4x762844%0.0280.7104.90 0.0160 | 4.57 0.0160 | 4.45 0.0170 | 4.40 0.0170
4x762846%0.0300.7604.87 0.0160 | 4.53 0.0160 | 4.42 0.0170 | 4.37 0.0180
5x762848%0.0391.0004.85 0.0160 | 4.50 0.0160 | 4.40 0.0170 | 4.35 0.0180
6x762848%0.0471.2004.85 0.0160 | 4.50 0.0160 | 4.40 0.0170 | 4.35 0.0180
8x762845%0.0581.4604.89 0.0160 | 4.55 0.0160 | 4.46 0.0170 | 4.36 0.0170
Prepreg Data
Glass StyleResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz1 GHz2 GHz10 GHz
10672%0.00200.0514.30 0.0180 | 4.10 0.0190 | 3.95 0.0200 | 3.90 0.0240
10676%0.00240.0604.28 0.0190 | 4.02 0.0200 | 3.87 0.0210 | 3.82 0.0250
108064%0.00290.0734.50 0.0170 | 4.30 0.0180 | 4.05