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RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB

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RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB

MOQ:1 PIECE Price:USD 9.99-99.99 Standard Packaging:VACUUM Delivery Period:10 WORKING DAY Payment Method:T/T,Paypal Supply Capacity:50000 PIECE PER MONTH

Detail Information

AttributeSpecification
Place of OriginCHINA
Brand NameBicheng Technologies Limited
CertificationUL
Model NumberBIC-185-V3.38
Board MaterialRO4533
Board Thickness0.8mm
Surface/Inner Layer Cu Thickness1oz
Surface FinishImmersion Gold
Coverlay ColourGreen
Color Of SilkscreenWhite
Function100% Pass Electrical Test
Number Of Layers2
Minimum Order Quantity1 PIECE
PriceUSD 9.99-99.99
Packaging DetailsVACUUM
Delivery Time10 WORKING DAY
Payment TermsT/T, Paypal
Supply Ability50000 PIECE PER MONTH

Product Description

Material Properties
PropertyRO4533DirectionUnitsConditionTest Method
Dielectric Constant, er Process3.3 ± 0.08Z10 GHz/23℃ 2.5 GHzIPC-TM-650,2.5.5.5
Dissipation Factor0.002Z2.5 GHz/23℃IPC-TM-650, 2.5.5.5
0.002510 GHz/23℃
PIM (Typical)-157dBcReflected43 dBm swept tonesSummitek 1900b PIM Analyzer
Dielectric Strength>500ZV/mil0.51 mmIPC-TM-650, 2.5.6.2
Dimensional Stability<0.2X,Ymm/m (mils/inch)after etchIPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion13Xppm/℃-55 to 288℃IPC-TM-650, 2.4.41
11Y
37Z
Thermal Conductivity0.6W/(m.K)80℃ASTM C518
Moisture Absorption0.02%D48/50IPC-TM-650, 2.6.2.1 ASTM D570
Tg>280℃TMA AIPC-TM-650, 2.4.24.3
Density1.8gm/cm 3ASTM D792
Copper Peel Strength6.9 (1.2)lbs/in (N/mm)1 oz. EDC post solder floatIPC-TM-650, 2.4.8
FlammabilityNON FRUL 94
Lead-Free Process CompatibleYes

RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

RO4533 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

Features and Benefits
  • Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use
  • Thermoset resin system: Compatible with standard PCB fabrication
  • Excellent dimensional stability: Greater yield on larger panels sizes
  • Uniform mechanical properties: Maintains mechanical form during handling
  • High thermal conductivity: Improved power handling
Typical Applications
  • Cellular infrastructure base station antennas
  • WiMAX antenna networks
Our PCB Capability (RO4533)

PCB Capability (RO4533) PCB Material:Ceramic-filled, Glass-reinforced Hydrocarbon Designation:RO4533 Dielectric constant:3.3 Dissipation Factor 0.0025 10GHz