Low Loss Large Size PCB

Rigid PCB Capabilities at PCBONLINE in 2024

PCB Layer Quantity

1-80L

Finish PCB Thickness

Max thickness 10mm

Min thickness 0.12mm (2L)

0.18mm (4L)

Tolerance

Thickness≤1mm: ±0.1mm

Thickness＞1mm: ±10%C

Finished PCB Length

Max length 1100mm

Min length 10mm

Finished PCB Width

Max width 570mm

Min width Relay VCC

Surface Finish

Sn thickness of HASL/LF-HASL

2-40um (0.4um on large Tin area of leaded HASL, 1.5um on large Tin area of lead-free HASL)

Min space between pads for HASL/LF-HASL PCB without solder mask

0.175mm (Pad space 0.25mm in large copper areas)

OSP thickness

0.2-0.6um

ENIG thickness

Ni: 3-8um; Au: 0.05-0.1um

Cannot do 0.08um min gold

Min space between pads for ENIG PCB

0.08mm (base copper 1/3 oz, 0.5 oz)

Immersion Silver

0.15-0.4um

Immersion Tin

≥1.0um

Hard gold

0.1-4.0um

Soft gold

0.1-4.0um

ENEPIG

Ni: 3-8um, Pd: 0.05-0.15um, Au: 0.05-0.1um

Flash gold(electroplated gold)

Ni: ≥3um; Au: 0.025-0.1um; base copper≤1oz

Electroplated Gold finger

Ni:≥3um; Au: 0.25-1.5um (the thinnest point)

Min space between gold fingers

Dry film pattern plating 0.175mm; lead process 0.125mm

ENIG+Gold finger

Yes (need line)

Flash gold(electroplated gold)+Gold finger

Yes

Immersion silver+gold finger

Yes (need line)

Immersion tin+gold finger

Yes (need line)

Inner Layer Line Width/Space

1/2OZ Limit

Normal 3/3mil

1OZ Limit

Normal 3/4mil

2OZ Limit

Normal 4/5mil

4/5.5mil

3OZ Limit

Normal 5/8mil

5/8mil

4OZ Limit

Normal 6/11mil

6.5/11mil

5OZ Limit

Normal 7/13.5mil

7/14mil

6OZ Limit

Normal 8/15mil

8/16mil

7OZ Limit

Normal 9/10mil

8OZ Limit

Normal 9/10mil

9OZ Limit

Normal 12/10mil

10OZ Limit

Normal 12/10mil

11OZ Limit

Normal 15/25mil

12OZ Limit

Normal 15/25mil

Tolerance

≤10mil: ±1.0mil, ±1mil

＞10mil: ±1.5mil, ±20%

Inner Layer Annular Ring

1/2OZ 6.5mil

1OZ 7mil

2OZ 7mil

3OZ 8mil

4OZ 8mil

5OZ 9mil

6OZ NA

7OZ NA

8OZ NA

9OZ NA

10OZ NA

11OZ NA

12OZ NA

Inner Layer Grid

1/2OZ 8/8mil

1OZ 10/10mil

2OZ 12/12mil

3OZ Yes, not defined

4OZ Yes, not defined

5OZ Yes, not defined

6OZ Yes, not defined

7OZ NA

8OZ NA

9OZ NA

10OZ NA

11OZ NA

12OZ NA

Min Space Between Hole Wall and Conductor

Min space between hole wall and conductor (mechanical blind and buried vias and 2+2+2 laser buried and blind vias)

0.175mm (normal 0.2mm) for one-time laminating, 0.2mm (normal 0.225mm) for two times laminating, 0.225mm for three times laminating

Min space between hole wall and conductor (None blind and buried vias and 1+N+1 laser blind via)

0.1375mm (normal 0.175mm) (≤8L), 0.1625mm (normal 0.2mm) (10-14L), 0.175mm (normal 0.2mm) (＞14L)

Min space between laser holes and conductor (1+N+1 and 2+N+2 HDI PCB)

0.05mm (PTH PCB)

Min Width of Internally Isolated Strip

0.2mm

Min Inner Layer Core Thickness

Relay VCC

Lamination

Min Isolation Thickness Between Layers

0.05mm (just for base copper 0.5 oz)

Layer-to-layer Registration Tolerance (mm)

0.125mm (normal 0.15mm)

Hole

Finished Mechanical Hole Size

0.1-6.1mm (corresponding drilling tool size 0.15-6.2mm)

Min Finished Hole Size for PTFE Material and Hybrid PTFE PCB

0.25mm

Min Connecting Hole Size

0.35mm (corresponding drilling tool size is 0.45mm)

Min Half-hole (PTH) Size

0.3mm (corresponding drilling tool size is 0.4mm)

Max Aspect Ratio for PTH Hole

20: 1 (hole diameter＞0.2mm）

Min Space Between Hole Walls in Different Nets After Compensation

0.25mm

Min Space Between Hole Walls in the Same Net After Compensation

0.15mm (PTH-hole & laser hole PCB), 0.25mm (Mechanical blind & buried hole PCB)

Min Space Between NPTH Hole Walls

0.2mm

Hole Location Tolerance (Compared with CAD Data)

±0.05mm

NPTH Tolerance

±0.05mm (limit +0/-0.05mm or +0.05/-0mm)

Pressfit Hole Tolerance

±0.05mm

+0.06/-0.04mm

Countersink Depth Tolerance

±0.15mm

Countersink Hole Size Tolerance

±0.15mm

Countersink Size and Angle

PTH and NPTH, special: 82°, 90°, 120°, 135° (countersink drilling size 12-393.7mil)

PTH and NPTH, standard: angle130° (drilling size≤125mil), 165°(drilling size 125--248mil)

Countersink Angle Tolerance

±10°

Irregular Slot Tolerance (Routing Holes)

±0.1mm

normal ±0.125mm

Min Tolerance for Drilling Slot

NPTH Slot:

Length/width≥2, width ±0.05mm, and length tolerance ±0.05mm; Length/width＜2, width ±0.075mm, and length tolerance ±0.075mm

PTH Slot:

Length/width≥2, width ±0.075mm, and length tolerance ±0.075mm; Length/width＜2,width ±0.075mm, and length tolerance ±0.1mm

Min Width of Drill Slot

0.45mm

Backdrilling

Drill Hole Size for Backdrilling

0.5-6.2mm

Min. Depth of Backdrilling

0.2mm

Insulation Thickness Between Backdrilling Layers (Backdrilling Target Layer That Must Be Cut & the Next Layer That Must Not Cut

≥0.2mm

Depth Tolerance to Backdrilling

±0.1mm

Stub (Copper Barrel That Remains After Backdrilling, Measured from the Must-not-cut Layer)

Not defined

Pad (Ring)

Min Pad Size for Laser Drill

Hole diametrer D+0.15mm

Min Pad Size for Mechanical Drilling

Hole diametrer D+0.2mm

Min BGA Pad Size

HASL: 0.25mm,

LF HASL: 0.3mm,

Other surface finishes: 0.175mm

Pad Size Tolerance (BGA)

±0.03mm (pad size≤0.3mm);

±10% (pad size≥0.3mm)

Outer Layer Line Width/Space

1/3OZ: Best

Normal 3.0/3.0mil

3.5/3.5mil

1/2OZ: Best

Normal 3.5/3.6mil

4/4mil

1OZ: Best

Normal 4/4.5mil

5/5mil

2OZ: Best

Normal 5/6mil

7.5/8mil

3OZ: Best

Normal 6/7.5mil

9.5/10mil

4OZ: Best

Normal 14/12mil

14/14mil

5OZ: Best

Normal 18/17mil

18/18mil

6OZ: Best

Normal 20/24mil

22/26mil

7OZ: Best

Normal 22/26mil

24/28mil

8OZ: Best

Normal Yes

9OZ: Best

Normal Yes

10OZ: Best

Normal Yes

11OZ: Best

Normal Yes

>=12OZ: Limit

Normal Yes

Width Tolerance

±20%

(Impedance boards ±10%)

Outer Layer Grid

1/3OZ 6/6mil

1/2OZ 6/6mil

1OZ 6.5/6mil

2OZ 10/11mil

3OZ 10/13mil

4OZ 12/16mil

5OZ Yes

6OZ Yes

7OZ NA

8OZ NA

9OZ NA

10OZ NA

11OZ NA

12OZ NA

Min Space of SMD Pads (Requiring Solder Mask Bridge) Before Compensation

1/3 OZ base copper Not defined

1/2 OZ base copper Limit: 7.2mil (black sm: add 1.5mil, immersion tin: add 2mil, on ground copper area: add 4mil)

1 OZ base copper Limit: 8mil (on ground copper area: add 4mil)

2 OZ base copper Limit: 11mil (on ground copper area: add 2mil)

3 OZ base copper Limit: 12mil (on ground copper area: add 2mil)

4 OZ base copper Not defined

Position Tolerance

Tolerance Between Pad and Pad (Fiducial Mark Pad to Fiducial Mark Pad)

L≤300mm: ±0.1mm

L＞300mm: ±0.125mm

Tolerance Between Hole and Hole

NA

Tolerance Between Pad Center to Hole Center

NA

Via Filling with Resin for Via in PAD (POFV/ VIPPO)

Finished Hole Size for Via Filling with Resin

0.1-0.9mm (drill size 0.15-1.0mm),

0.3-0.55mm normal (drill size 0.4-0.65mm)

Max Aspect Ratio for Via Filling with Resin PCB

12: 1

Min Resin Plugged PCB Thickness

0.2mm

Max Via-filling-with-resin PCB Thickness

3.2mm

Can You Make Different Hole Sizes in One Board?

Yes

Via Filling with Conductive Copper Paste/Silver Paste

Via Filling with Conductive Copper Filling

Yes

Via Filling with Conductive Silver Filling

Yes

Peelable Mask

Max Hole Size of Peelable Mask Plugging

5mm

The Thickness of Peelable Mask

0.2-0.78mm

Min Space Between Peelable Soldermask and Pads

0.35mm

Peelable Solder