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Low Loss Multilayer PCB for Consumer Electronics

Multilayer PCB Manufacturer-Multilayer PCB Prototype-SprintPCB

Multilayer PCB

Used in Complex and High-Reliability Applications Up to 60 layers | Advanced PCB Technology | Fast Turnaround | RoHS & UL Certified

Multilayer PCB

4-60 layers for ultra-high routing density

Excellent signal integrity and electromagnetic compatibility

Support for blind & buried vias, via-in-pad, and impedance control

Engineered and manufactured with precision at SprintPCB's advanced facility

Used in servers, networking equipment and high-end medical devices

Multilayer PCB: High-Performance Solutions for Complex Applications

At SprintPCB, we specialize in designing and manufacturing multilayer PCBs that meet the highest standards of quality and performance. With up to 60 layers, our PCBs are built for ultra-high routing density, making them ideal for complex and compact electronic devices. Whether you're working on cutting-edge servers, networking equipment, or high-end medical devices, SprintPCB provides reliable solutions that ensure exceptional signal integrity and electromagnetic compatibility (EMC).

Key Features of Our Multilayer PCBs
  • Up to 60 Layers for Ultra-High Routing Density
  • Superior Signal Integrity & Electromagnetic Compatibility (EMC)
  • Support for Blind & Buried Vias, Via-in-Pad, and Impedance Control
  • Precision Engineering & Manufacturing
  • Versatile Applications

Process Capabilities

FeatureTechnical specification
Number of layers4 – 60 layers
PCB thickness0.40 mm – 7.0 mm
Copper weights (finished)0.5 OZ – 6 OZ
MaterialsHigh performance FR4, halogen-free FR4, low loss and low Dk materials
Max. dimensions620 mm x 720 mm
Min. track and gap0.075 mm / 0.075 mm
Min. mechanical drill0.15 mm
Surface finishes availableHASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Impedance Control±8% tolerance
Special ProcessesBlind/Buried Vias, Via-in-pad, Backdrill, Sideplating,Countersunk Holes

Why Choose SprintPCB for Multilayer PCB?

SprintPCB specializes in the manufacturing of multilayer PCBs with up to 60 layers, supporting high-speed, high-frequency,and impedance-sensitive designs. Our state-of-the-art lamination processes and advanced testing ensure performance, reliability, and long-term stability in your applications.

From Prototype to Production – We Support You All the Way
  • Engineering Support
  • Prototyping Services
  • Fast Turnaround
  • Seamless Transition to Mass Production
PCB Manufacturing Equipment

SprintPCB operate with most advance equipment in the industry to provide efficient production and high quality products with value added to our partners

  • Alkaline Etching Line
  • Solder mask spraying
  • Silkscreen Printing
  • Circuit LDI
  • Acid Etching Line
  • Brown Oxide line
  • Hot Oil Lamination Press
  • CNC Routing Machine
  • Drilling
  • Copper plating
  • Board Plating
  • Resin plugging machine
  • Pattern Plating
  • Alkaline Etching Line
  • Solder mask spraying
  • Silkscreen Printing
  • Circuit LDI
  • Acid Etching Line
  • Brown Oxide line

Ready to Start Your Multilayer PCB Project?

FAQ about Multilayer PCB

What materials are used in the construction of a multilayer PCB?

The materials used in a multilayer PCB typically include a substrate material, conductive layers (such as copper), insulating layers (such as polyimide or FR4).

How does a multilayer PCB differ from a single-layer PCB?

A single-layer PCB only has one layer of conductive material, while a multilayer PCB has multiple layers of conductive material. The multiple layers in a multilayer PCB allow for