Multilayer PCB molding is a process in which the cores and insulation are joined into one compact unit. Our new pressing center with advanced automation allows us to press not only standard materials, but also hybrid compositions, special and flexible materials as well as multiple laminations. Pinless registration using induction welding of blanks is used for guidance.
An automatic pressing center that includes a high-temperature press, a cooling press, tool storage and automation for tool handling. The presses are hydraulic with a maximum operating temperature of 300°C and a capacity of four daylights.
Single daylight electric high-temperature press used as alternative to large-capacity Lauffer presses and for PCBs that require high-temperature pressing up to 400°C. The press is also often used for pressing flexible PCB, specifically for pressing coverlay (kapton) and reinforcements (stiffeners).
The optical pinless registration system allows for pinless lamination of multilayers and sequential lamination build up technology. Three different processes take place in one unit: layup, layer to layer alignment and bonding. This process eliminates the added tolerances associated with pin lamination.
Multilayer PCBs: filling, measured impedances, via-in-pad, RF materials, e.g. IPC class 3 standard
Hybrid PCBs combining special material and FR4
Flexible printed joints, single and double-sided, with stiffener support.
HDI PCB - High Density Interconnect PCBs, high-tech MDI (Micromirror Digital Imaging) for both motif and mask
A wide range of special PCB boards using special materials, tailored to you
Aluminium with IMS core, including trendy LED CB boards.
Compact solution thanks to conductive connections on both sides of the board
Full service for small, medium and large series of printed circuit boards
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Průmyslová 2503/2, 680 01 Boskovice
ID: 08976295
B 8345/KSBR Regional court in Brno
