Helen Frankenthaler PCB Circuit Board R&D Center

microwave & rf pcb grc

Wholesale Best Rogers RO3003 Microwave 2-Layer 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB

Rogers RO3003 Microwave 2-Layer 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB

Rogers RO3003 PCB is an excellent choice for high-frequency applications that require low loss, high thermal conductivity, and excellent electrical properties.

  • Item NO.: BIC-038-v199.0
  • Order(MOQ): 1-10
  • Payment: T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin: China
  • Color: White
  • Shipping Port: Shenzhen
  • Lead Time: 7-10 days

Product Detail

Rogers RO3003 Microwave PCB 2-Layer Rogers 3003 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3003 PCB is a high-frequency material known for its excellent electrical properties, low loss, and high thermal conductivity. It is widely used in applications such as wireless communication systems, radar systems, satellite systems, and high-speed digital circuits.

One of the significant benefits of RO3003 is its low dielectric loss, making it ideal for high-frequency applications. It also has a low dissipation factor, high thermal conductivity, and excellent dimensional stability. The material's high glass transition temperature (Tg) also ensures its stability in high-temperature environments.

RO3003 substrate has a dielectric constant of 3.0 and a loss tangent of 0.0013 at 10 GHz, which is lower than other high-frequency PCB materials. It also has a low moisture absorption rate and excellent electrical and mechanical properties over a wide temperature range, from -55°C to 150°C.

The material's excellent properties make it an ideal choice for applications that require high-frequency performance and reliability, such as high-speed digital circuits, microwave devices, power amplifiers, and antennas.

Typical applications:
  • Automotive radar
  • Cellular telecommunications systems
  • Datalink on cable systems
  • Direct broadcast satellites
  • Global positioning satellite antennas
  • Patch antenna for wireless communications
  • Power amplifiers and antennas
  • Power backplanes
  • Remote meter readers
PCB Specifications

PCB SIZE 90 x 75mm=1PCS

BOARD TYPE Double sided PCB

Number of Layers 2 layers

Surface Mount Components YES

Through Hole Components NO

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

RO3003 0.508mm

copper ------- 18um(0.5 oz) + plate BOT Layer

TECHNOLOGY

Minimum Trace and Space:5 mil / 5 mil

Minimum / Maximum Holes:0.5mm

Number of Different Holes:1

Number of Drill Holes:1

Number of Milled Slots:0

Number of Internal Cutouts:0

Impedance Control:no

Number of Gold finger:0

BOARD MATERIAL

Glass Epoxy:RO3003 0.508mm

Final foil external:1 oz

Final foil internal:N/A

Final height of PCB:0.6 mm ±0.1

PLATING AND COATING

Surface Finish Immersion gold (31%)

Solder Mask Apply To:NO

Solder Mask Color:N/A

Solder Mask Type:N/A

CONTOUR/CUTTING

Routing

MARKING

Side of Component Legend Top Side

Colour of Component Legend Black

Manufacturer Name or Logo:Marked on the board in a conductor and legend FREE AREA

VIA

N/A

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

Outline dimension:0.0059"

Board plating:0.0029"

Drill tolerance:0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

Data Sheet of Rogers 3003 (RO3003)

PropertyRO3003DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3Z8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.001Z10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-3Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.06 0.07X Ymm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity107COND AIPC 2.5.17.1
Tensile Modulus930 823X YMPa23℃ASTM D 638
Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
Specific Heat0.9j/g/kCalculated
Thermal Conductivity0.5W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃)17 16 25X Y Zppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500℃TGA ASTM D 3850
Density2.1gm/cm323℃ASTM D 792
Copper Peel Stength12.7Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0UL 94
Lead-free Process CompatibleYes

BICHENG PCB EQUIPMENT:

BICHENG PCB EQUIPMENT:

BICHENG PCB CERTIFICATION:

BICHENG PCB CERTIFICATION:

Major material Supplier

BICHENG PCB MAIN COURIERS:

BICHENG PCB MAIN COURIERS:

Hot Tags :

Rogers RO3003 Microwave PCB 2-Layer Rogers RO3003 PCB 20 mil RO3003 PCB Rogers DK3.0 3003 PCB Rogers DF 0.001 3003 PCB Double Sided Rogers RO3003 Microwave PCB

  • Previous: Rogers 5880 15mil 0.381mm High Frequency PCB Supplier
  • Next: RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB Low DK3.0 and Low DF 0.001

Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • Subject : Rogers RO3003 Microwave 2-Layer 20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB
Categories
  • Newly Shipped RF PCB
  • High Frequency PCB
  • Taconic PCB Board
  • Rogers PCB Board
  • PTFE PCB Board
  • Flexible Printed Circuit
  • PCB Prototype
  • Multilayer PCB Board
  • High Temperature PCB
  • HDI PCB Board
  • Metal Core PCB
  • Impedance Controlled PCB
  • Hybrid PCB Board
  • PCB SMT Stencil
  • FR-4 PCB Board
  • Ceramic PCB
  • Copper Clad Laminates
New Products
  • F4BM255 Laminate