microwave & rf pcb injection

Rogers RF & Microwave Materials

Rogers Corporation manufactures the following product lines:

Rogers RO series and KAPPA™

• Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.
• RO3000® very low loss ceramic-filled PTFE materials for use in various commercial microwave and RF applications.
• RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.
• KAPPA™ Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes.

Rogers RT Duroid and TMM

• RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
• Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity.

Rogers CuClad®, DiClad® and IsoClad® Laminates

• Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.
• IsoClad® laminates are non-woven fiberglass reinforced PTFE based composites for use as printed circuit board substrates.
• Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications.

Rogers AD, CLTE, TC Series

• Rogers AD Series woven glass PTFE based laminates designed for use in high frequency antenna and communication applications.
• Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability, Radar and communication systems.
• Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.

Rogers Copper, Prepregs & Bondply

• Rogers offers a wide arrangement of bonding and adhesion materials directly matched to complement our broad, industry-leading, high frequency circuit material offerings.
• Rogers CU4000™ and CU4000 LoPro® electro-deposited copper foils enable multi-layer board designs using RO4000® cores and prepreg materials requiring bonded outer layers.

Rogers Specialty products

• Rogers MAGTREX® 555 high impedance laminates are the first commercially available low loss laminate with controlled permeability and permittivity.
• Rogers Radix™ Printable Dielectric material is the first UV-curable 3D printing resin designed for RF applications, enabling designers to leverage the design freedom of additive manufacturing for greater performance and flexibility.