Helen Frankenthaler PCB Circuit Board R&D Center

non flex pcb

Rigid PCBs - Electronic Components Marketing Group

flex rigid pcb manufacturing electronics factory

Rigid PCB Solutions

Electronic Components Marketing Group

At ECMG, our clients come to us in need of rigid printed circuit boards (PCBs) for a variety of reasons. One of the main reasons is cost. A rigid PCB is the most common component in electronic assembly. Unlike flex PCBs, a rigid PCB cannot be twisted or bent, but instead is built with a rigid fiberglass layer that gives it extra strength.

Rigid PCBs are made of copper foil layers laminated between a solid fiberglass substrate with copper tracks and component layouts. They also have a solder mask layer that adds insulation to the copper and a silkscreen layer which is used for component placement and other nomenclature.

Depending on your needs, a rigid PCB may be the right solution for you. Use the buttons below to request a quote or learn more about your PCB options.

Rigid PCB Capabilities

Double-Sided & Multi-Layered
ItemsMass SampleLayers2-68L Up to 120LMax. Board Thickness10mm(394mil)14mm(551mil)Min. Width/Space Inner Layer50/50um 40/40umOuter Layer65/65um 50/50umRegistration Same Core±25um±20umLayer to Layer±4.5mil±4milMax. Copper Thickness6oz 30ozMin. Drill Hole Diameter Mechanical≥0.15mm(6mil)≥0.1mm(4mil)Laser0.1-0.35mm 0.05-0.35mmMax. Size
(Finish Size)Line-card850mmX570mm1000mmX570mmBackplane1250mmX570mm1320mmX570mmAspect Ratio (Finish Hole)Line-card20:127:1Backplane25:132:1Material FR4EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HFHigh SpeedMegtron4, TU872SLK, FR408HR,N4000-13 Series, S7439C,TU863+, Megtron6, MW2000, IT968,EM891, Megtron7,MW4000,TU933,DS7409DVN,IT988GSEHigh FrequencyRo3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY series,AD series,RT6002OthersPolyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,ST115Surface FinishHASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG 20
Double-Sided & Multi-Layered Roadmap
Products201920202021
Mass SampleMass SampleMass SampleMass Sample
Backplane Layers2-68L Up to 120L2-68L Up to 120L2-68L Up to 120L
Finish Size1250mmX570mm 1320mmX570mm1250mmX570mm 1320mmX570mm1250mmX570mm 1320mmX570mm
Board Thickness10mm 14mm10mm 14mm10mm 14mm
Aspect Ratio(0.31mmFinishHole25:1 32:125:1 35:130:1 35:1
Aspect Ratio(0.36Finish Hole)27:1 33:127:1 33:127:1 33:1
Line-card Layers32 3636 3636 36
Width/Space(Outer Layer)3mil/3mil 2.5mil/2.5mil3mil/3mil 2.5mil/2.5mil3mil/3mil 2.5mil/2.5mil
Width/Space(Inner Layer)2.2mil/2.2mil 2mil/2mil2.2mil/2.2mil 2mil/2mil2.2mil/2.2mil 2mil/2mil
Aspect Ratio(0.15mmFinish Hole20:1 25:122:1 25:122:1 25:1
Aspect Ratio(0.20mmFinish Hole)21:1 27:124:1 27:125:1 27:1
Impedance Tolerance±7%±5%±5%±5%±5%±5%

Contact Us

Fill Out The Form Below To Contact Us
  • Full Name*
  • Phone*
  • Email*
  • How Can We Help?*
    • Request Quote
    • Prototype Request
    • Request Consultation
    • General Question
  • How Can We Help?*
  • CAPTCHA

Capabilities

click through any of the buttons below to see their full capabilities matrix

Double-Sided & Multi-Layered

Double-Sided & Multi-Layered Roadmap

Rigid PCB Uses

Large Vehicles PCB