Polyimide Carbon Ink PCB for Consumer Electronics

Rigid Pcb : Industry Grade Printed Circuit Board Performance

Multilayer PCB Manufacturing

Product design, system speed requirements, microprocessors, and component scaling, and increased thermal performance are driving advances in PCB technology every day. Hemeixin’s technical and production capability and aggressive technology roadmap has kept pace with these changes and provides a scalable platform for growth.

• Layers (2-64)
• HDI PCB : 9+N+9 (Anylayer)
• Glass epoxy (GF) laminate, Tg – 180ºc Epoxy (IT180A, FR370HR etc)
• Polyimide rigid pcb laminate (Alron85N, Isola P95, Isola P96, Ventec VT901 etc)
• Low loss pcb material (I-Speed material, FR408HR, Megtron4, EM-888, N4000-13EP, N4000-13, TU-863+, TU-872lk, TU-872SLK, TU-872SLK SP etc)
• High Speed Digital PCB laminate: (I-Tera MT40 / RF, Tachyon-100G, Megtron6/R-5775, TU-883, TU-883SP, IT-968, IT968SE etc)
• RF PCB, Microwave pcb laminate: (RO4450F, Rogers 4350B, RO4835, RO4003, RO4533, Taconic TLY series, TLY-5, RF35, TSM-DS3, Astra MT77, RT/Duroid 5880, RO3203, RO3003 etc)
• MCPCB (Aluminum core or Copper Plates) laminate: Thermal conductivity:2.2~7 (W/m*k)
• Special process PCB: Countersink hole pcb, Press fit pcb, Semi flex pcb, Castellated holes pcb, Cavity pcb etc)
• Special Surface PCB: Selective gold plating pcb, Hard gold pcb, Gold fingers pcb, ENEPIG plating PCB
• Hybrid pcb , Blind and Buried Vias; Filled via capability
• Back drill: Min hole size 15.7mils Depth tolerance +/-6mils