Helen Frankenthaler PCB Circuit Board R&D Center

Polyimide Prototype PCB for Consumer Electronics

Polyimide Film Based FCCL and Flexible Circuit Products

Flexible Copper Clad Laminate (FCCL) Polyimide Film Based FCCL--3 Layer FCCL

Epoxy resin PI film based FCCL(Halogen-Free) is composed of three kinds of materials, copper foil, adhesive and PI film, which are compounded by high precision coating technology. With high temperature resistance, high insulation, high flexibility and other characteristics. Widely used in FPC manufacturing.

Type

Single-side FCCL, Double-side FCCL.

Application

Products are mainly used in notebook computers, monitors, mobile phone antennas, mobile phones, printers, electronic appliances, industrial instruments, communication equipment and other circuit.

Feature

  • Excellent high humidity and temperature resistance
  • Excellent dimensional stability,High flexibility and Excellent Migration ability
  • Excellent electrical,chemical and thermal property
  • Halogen free and Flame retardancy UL 94VTM-0
  • Meet with IPC standards

Product Specifications

ItemTest methodSpecification
Width Specification250±1mm
Polyimide thickness Specification12.5um、25um
Adhesive thickness Specification13-25um
Copper thickness Specification12.5um、18um、35um
Shelf life25±10℃,65±20﹪RH12months

Product Properties

ItemTest methodSpecification
Peel strength As ReceivedIPC TM650 2.4.9≧0.8kgf/cm
After MEK/10min≧0.8kgf/cm
Solder Float Resistance (After 165℃±5℃ 1hr)IPC TM650 2.4.13288℃ 10sec
Dimensional StabilityIPC TM650 2.2.4TD≦±0.2% MD≦±0.2%
Chemical Resistance MEK 5minIPC TM650 2.3.2No Evident of Defects
HCl 5% 5min
NaOH 5% 5min
Surface Resistivity(Ω)IPC TM650 2.5.17≧1.0*1013Ω
Volume Resistivity(Ω.cm)IPC TM650 2.5.17≧1.0*1015Ω.cm
Insulation Resistance(Ω)IPC TM650 2.6.3.2≧1.0*1011Ω

Adhesiveless Single-Sided Copper Clad Laminate-- 2 Layer FCCL

FCCL-TD-X (Single)

Product Characteristics:
  • High Tensile Strength
  • Excellent dimensional stability
  • High Flexural Endurance
  • Flexibility to match the thickness PI: 13,25 um Copper: 12,18,35 um (ED or RA)
  • Sheet Size: 250mm*100M

Adhesiveless Double-Sided Copper Clad Laminate-- 2 Layer FCCL

FCCL-TD-W, FCCL-TD-A (Double)

Product Characteristics:
  • Excellent heat resistance and chemical resistance
  • High Flexural Endurance
  • Excellent dimensional stability
  • Flexibility to match the thickness
  • Finer line etching capability.
  • PI: 20,25 um Copper: 12,18 um (ED or RA)
  • Sheet Size: 250mm*100M

Conductive Adhesive Film CAF-TD200,CAF-TD300

Product Characteristics:
  • Low moisture absorption
  • High reliability and conductivity
  • Excellent heat resistance
  • Long shelf-life
  • Good peel strength
  • Good binding force with PI and SUS
  • Meet the requirements of lead-free reflow soldering
  • Thickness: 60±10% um
  • Peel strength: ≥1.0 kgf/cm
  • Water absorption: 0.11 -0.13 %

EMI Shielding Film Electromagnetic Interference Shielding Film ESF-TD1600,ESF-TD2300

EMI Shielding Film is mainly used in FPC which consist of Modules for mobile phones,PC,medical devices,digital cameras,automotive instruments,etc. It meet high-frequency signal transmission and effectively shield the interference of electromagnetic waves. The product has excellent flexibility, extremely low insertion loss, extremely high shielding effectiveness and stable impedance control. Specially applied to flexible circuit board and soft-hard combination board.

Product Characteristics:
  • High performance in shielding effectiveness (SE)
  • Achieve consistent impedance control design
  • High Filling
  • PI type insulation layer, excellent surface hardness, or PET
  • Meet environmental requirements
  • Thickness: 17±2um ,12±2um
  • Peel strength: ≥0.7 kgf/cm
  • Shielding efficiency: 63,65 dB @1GHz , 75 dB,

Ultrathin FCCL Ultrathin FCCL TD-FNC

has high peeling strength, outstanding soldering reliability, dimensional stability, mechanical and electrical properties. The copper is highly uniform with tight tolerance, higher tensile strength, and free pinholes. We can provide ultra-thin copper (2~9μm), and the structure of FCCL can be customized.

Product Characteristics:
  • High peel strength.
  • Outstanding soldering reliability,dimensional stability and chemical resistance.
  • Excellent mechanical and electrical properties.
  • Customized thin copper good for fine line.
  • FCCL structure: Copper : 2--9, 12/18,35 um + PI : 12.5/18/25/50 um + Copper : 2--9, 12/18,35 um

Ultra-Thin Peelable Copper Foil Ultra-Thin Peelable Copper Foil TD-FEC

is ultrathin copper foil produced using vacuum sputtering and electro-deposition technology,Mainly used in IC packaging, FPC micro line. Structure and size of copper can be customized.

Product Characteristics:
  • Peelable ultrathin copper foil and superior heat stability.
  • Low surface profile,high elongation and tensile strenth.
  • Superior etching,it is good for fine circuits,such as COF and thinner applications.
  • Ultrathin Copper Thickness: 1.5--6 um.
  • Carrier Cooper Thickness: 12, 18,35 um.

Composite Lithium-ion Battery Copper Foil Composite Lithium-ion Battery Copper Foil CTD-FEC

is an electrolytic copper foil for lithium-ion batteries independently. Compared with traditional lithium-ion battery copper foil, composite lithium-ion battery copper foil has the advantages of high safety,high energy density and long service life. The material has a sandwich-like structure, with PET, PI, PPS and other polymer films with a thickness of 4~8μm as the support layer, and the two sides of the support layer are copper layers with a thickness of 0.5~4μm.The copper-plated layer on both sides has low roughness, uniform thickness and fine microscopic crystal structure,which can be widely used in power batteries, new energy vehicles and other fields.

Product Characteristics:
  • Peelable ultrathin copper foil and superior heat stability.
  • Low surface profile,high elongation and tensile strenth.
  • Superior etching,it is good for fine circuits,such as COF and thinner applications.
  • Ultrathin Copper Thickness: 1.5--6 um.
  • Carrier Cooper Thickness: 12, 18,35 um.

TRF Embedded Resistor Film TRF Embedded Resistor Film TD-TRF

is an embedded resistor film, which has independently,TRF series can meet with the requirements of fine circuits, HDI, thinner PCB, and with high reliability, and is suitable for embedded resistor technology in high speed/high density circuit designs. It is widely used in 5G communication and consumption, electronics, automotive electronics, military industry and other fields.

Product Characteristics:
  • Direction-free for sheet resistivity.
  • Thickness and sheet resistivity is customized.
  • Suitable for conventional etching process,easy to operate.
  • High peel strength,and ESD is over 3kv .

Very Low Profile Copper Film(HVLP) Very Low Profile Copper Film

as Very low profile copper foil is an electrolytic copper foil. It has low surface profile, high elongation and tensile strength,high peeling strength and superior heat stability. The company's current very low profile copper foil specifications are mainly 9μm, 12μm and 18μm. The copper foil have uniform thickness and fine micro-crystal structure, which can be widely used in HDI, FPC, PCB, CCL, FCCL and other fields.

Product Characteristics:
  • Low surface profile,high elongation and tensile strength.
  • High peeling strength and superior heat stability.
  • Customized thickness and surface roughness.
  • Applicable to transmit in the high frequency and high-speed.
  • Very low profile copper foil Thickness: 9/12/18 um.

LCP FCCL(Single Side/Double Side)--2L FCCL

5G uses higher frequency signals, which requires higher dielectric constant and dielectric loss of materials. LCP, as the best FPC substrate to replace Pl, has been applied in connectors and iphone antennas.

Application:

5G base station antenna and power amplifier,5G mobile phone,Autopilot vehicle-mounted millimeter-wave radar,Large-scale phased antenna array,telemedicine.

Product Characteristics:
  • Excellent softness, mechanical properties, chemical resistance and heat resistance.
  • Ultra-low water absorption and water vapor permeability
  • Excellent dimensional stability and processability.
  • DK/Df has high stability at different frequencies/temperatures.
  • Thermoplastic resin system, which is directly hot-melt compounded, has good PCB processing performance and is suitable for the design of flexible multilayer boards.
  • Excellent cost performance.
  • LCP FCCL(Single side) structure: Copper : 12 um + High melting point LCP Film (25,50,75,100 um)
  • LCP FCCL(Double side) structure: Copper : 12 um + High melting point LCP Film (25,50,75,100 um) + Copper : 12 um
  • Width: 250mm or 520mm .

About Company:

Founded in 1997, is located in Jiangsu, covers an area of 21235 square meters, construction area of 5612 square meters.the company began with the Electrical Insulation Material and Technology to develop "polyimide film" " polyimide material"products, is the earliest, specifically engaged in polyimide film special engineering materials research and development, production and sales units one. In 2012. In 2015, the company set up R & D center in Jiangsu,Yancheng Economic Development Zone, covers an area of 21,235 square meters, construction area of 4622 square meters, pilot workshop built salivation method, Stretch polyimide film development of new production line 1. The company in 2010 was identified as "high-tech enterprises in Jiangsu Province", in 2012 through the ISO9001, ISO14001 management system certification. After the continuous technological innovation, new product development and expansion of production, the company has a two-way stretch of polyimide film production line, five salivation method of polyimide film production line, 8 FEP coated polyimide film production line , The scale of production, sales, sales and other comprehensive indicators in the domestic insulation materials industry, polyimide film among the best.