Helen Frankenthaler PCB Circuit Board R&D Center

Polyimide Rigid PCB for IoT Devices

HDI PCB - PCB@

HDI PCB

Email: pcb@frankenthalerfoundation.org Telephone: 0086-15919758327

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Parameters and features:

HDI PCB is a multi-layer circuit board with high wiring density, thin lines, spaces and micro-holes. They are designed to increase the functionality and performance of electronic products while reducing their size. High-Density Interconnect (HDI) PCBs represent technological advancements in printed circuit board design and manufacturing. These boards are known for their enhanced electrical performance and compact size.

  • Number of layers: HDI PCBs typically have more than two layers. Standard configurations include 4-layer, 6-layer, 8-layer, and up to 20 or more layers.
  • Microvias: Microvias are small, laser-drilled holes connecting different PCB layers, allowing for higher routing density.
  • Thin Lines/Spaces: HDI boards have narrow traces and gaps, usually measured in microns (μm). This allows for a more compact design.
  • Advanced Materials: HDI PCBs use advanced materials such as high-frequency laminates for optimal signal integrity and impedance control.
  • Aspect Ratio: Aspect ratio is the ratio of PCB thickness to microvia diameter. HDI boards usually have a high aspect ratio.
  • Blind and Buried Vias: These types of vias begin or end on inner layers, enhancing routing possibilities.
  • Via-in-Pad (VIP): This design places the via within the component bonding pad, allowing the use of smaller component sizes.

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Manufacturing process:

  • Lamination

    begins with heat and pressure to layer and bond thin core materials to create a multi-layer stack.

  • Drilling:

    Laser drilling and mechanical drilling can create micro vias and vias.

  • Copper Plating:

    After drilling, copper is deposited on the hole’s walls to create a conductive path.

  • Imaging:

    The photolithography process uses a layer of photoresist and ultraviolet light to define circuit patterns on each layer.

  • Etching:

    Chemically removing exposed copper, leaving the desired copper traces.

  • Copper Fill and Planarization:

    In the case of buried vias, any excess copper is filled and then planarized to create a flat surface.

  • Solder mask and screen printing:

    Solder mask insulates and protects copper traces, while screen printing adds component labels.

  • Surface Treatment:

    The PCB’s surface undergoes surface treatment, such as ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling).

Advantages of Heavy Copper PCB

  • High-Speed Data Processing: Supports NVMe, PCIe, and SATA interfaces for optimal performance.
  • Advanced Thermal Management: Utilizes copper layers and thermal vias for effective heat dissipation.
  • Compact & Lightweight Design: Enables ultra-thin and high-density storage solutions.
  • Customizable Form Factors: Tailored for M.2, U.2, and 2.5-inch SSD designs.

SSD PCB VS. HDD PCB

Why choose us:

  • Competitive Pricing

    With more than a decade of experience in the PCB industry, we have established a reliable supply chain that ensures quality components at competitive prices. For complex projects requiring unique materials or advanced technical specifications, our strong manufacturing capabilities enable us to provide cost-effective solutions while maintaining high quality.

  • Fast and reliable delivery

    We ensure fast production and delivery. Our partnership with multiple global logistics providers guarantees timely and reliable transportation, supported by our digital factory management and 90% automation for greater efficiency.

  • Quality Assurance:

    Our rigorous quality inspection begins with incoming material checks. We use AOI to detect defects and X-rays to identify internal issues. Electrical performance testing is performed with advanced automatic test machines and flying probe testers. Before shipment, our dedicated QC team conducts a thorough manual visual inspection to ensure all products meet strict quality standards.

We have many international certifications:

We also hold several international quality certifications:

  • IATF 16949:2016
  • ISO 9001:2015
  • ISO 45001:2018
  • UL

At the same time, we are always committed to environmental protection. We have an environmental management system certification to ensure that our manufacturing process is environmentally friendly and sustainable.