Polyimide for Polyimide Flex Circuit: The Superior Choice with APICAL® Polyimide Film
Polyimide Flex Circuit are integral to modern technology, found in everything from automobiles, portable phones, and SLR cameras to sophisticated military and avionics systems. Something as common as a notebook computer or tablet wouldn’t be possible without Polyimide Flex Circuit technology, which allows hundreds of tiny components to be electronically connected in a three-dimensional array. The critical role of polyimide for Polyimide Flex Circuits in these applications cannot be overstated.
The specification criteria that a polyimide film must meet are among the most stringent in the Polyimide Flex Circuits industry. APICAL® Polyimide exceeds these criteria because it was specifically designed for this exceptionally demanding application. As a result, all users of APICAL® Polyimide benefit from a precision product made with leading-edge technology. This makes APICAL® Polyimide the premier polyimide for Polyimide Flex Circuits, certified to IPC Specification 4202/1.
Starting with the manufacturing process, the superior properties of APICAL® Polyimide make it the best choice as a substrate for Polyimide Flex Circuitry. Produced in a clean room environment and 100% optically inspected for pinhole and inclusion defects, APICAL® Polyimide ensures the highest quality standards. This meticulous process guarantees that APICAL® Polyimide stands out as the optimal polyimide for Polyimide Flex Circuits.
APICAL® Polyimide’s 400ºF heat resistance allows for easy wave or hand soldering, making it ideal for Polyimide Flex Circuit applications. Its overall chemical resistance and alkaline etchability enable it to be chemically milled while enduring the rigors of Polyimide Flex Circuit (PFC) processing. This exceptional durability underscores why APICAL® Polyimide is the preferred polyimide for Polyimide Flex Circuits.
The physical toughness of APICAL® Polyimide allows it to be flexed reliably and repeatedly for millions of cycles. This makes it an invaluable material for Polyimide Flex Circuits that require long-term reliability and performance. Additionally, APICAL® Polyimide NP, developed specifically for the FPC industry, gives circuit designers the flexibility to match the polyimide film’s coefficient of thermal expansion (CTE) closely to the CTE of copper. This matching prevents circuit curling during temperature cycling, further solidifying its position as the top polyimide for Polyimide Flex Circuits.
